Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
SN74ACT2236-20FN

SN74ACT2236-20FN

Texas Instruments

BI-DIRECTIONAL FIFO, 2KX9

381

72V851L10PFG8

72V851L10PFG8

Renesas Electronics America

IC FIFO SYNC 4096X18 10NS 64QFP

0

CY7C419-15JXC

CY7C419-15JXC

IR (Infineon Technologies)

FIFO, 256X9, 15NS, ASYNCHRONOUS

269

SN74V3640-7PEU

SN74V3640-7PEU

Texas Instruments

FIFO, 1KX36, 5NS, SYNCHRONOUS

761

SN74ACT3622-15PQG4

SN74ACT3622-15PQG4

Texas Instruments

BI-DIRECTIONAL FIFO, 256X36

2304

SN74ALVC3641-15PQ

SN74ALVC3641-15PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 1KX36

233

SN74ACT3632-30PQ

SN74ACT3632-30PQ

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

809

72V271LA15PFGI8

72V271LA15PFGI8

Renesas Electronics America

IC FIFO SS 16384X18 15NS 64QFP

0

SN74ACT7204L15RJR

SN74ACT7204L15RJR

Texas Instruments

FIFO, 4KX9, 15NS, ASYNCHRONOUS

1500

7282L12PAG

7282L12PAG

Renesas Electronics America

IC FIFO 1KX9 12NS 56TSSOP

0

CY7C4231-25JCT

CY7C4231-25JCT

Rochester Electronics

FIFO, 2KX9, 15NS, SYNCHRONOUS

275

CY7C4201-15JC

CY7C4201-15JC

Rochester Electronics

FIFO, 256X9, 10NS, SYNCHRONOUS

1283

QS7204-20P

QS7204-20P

FIFO, 4KX9, 20NS, ASYNCHRONOUS

366

SN74V245-15PAG

SN74V245-15PAG

Texas Instruments

IC SYNC FIFO MEM 4096X18 64-TQFP

379

72V275L15PFG

72V275L15PFG

Renesas Electronics America

IC FIFO SYNC 3.3V 64-TQFP

0

SN74ACT7811-18FN

SN74ACT7811-18FN

Texas Instruments

FIFO, 1KX18, 18NS, SYNCHRONOUS

3396

CY7C4205-10AXC

CY7C4205-10AXC

IR (Infineon Technologies)

FIFO, 256X18, 8NS, SYNCHRONOUS

1057

72V265LA10TFG

72V265LA10TFG

Renesas Electronics America

IC FIFO SS 16384X18 10NS 64STQFP

0

CY7C4225-10AI

CY7C4225-10AI

FIFO, 1KX18, 8NS, SYNCHRONOUS

8

72251L15PF

72251L15PF

Renesas Electronics America

IC FIFO SYNC 512X9 15NS 32QFP

16

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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