Logic - FIFOs Memory

Image Part Number Description / PDF Quantity Rfq
7281L15PAGI8

7281L15PAGI8

Renesas Electronics America

IC MEM FIFO 512X9 15NS 56-TSSOP

0

72801L10PFG8

72801L10PFG8

Renesas Electronics America

IC FIFO SYNC DUAL 256X9 64-TQFP

0

SN74ACT7813-25DL

SN74ACT7813-25DL

Texas Instruments

FIFO, 64X18, 15NS, SYNCHRONOUS

1733

72V36110L7-5PFGI

72V36110L7-5PFGI

Renesas Electronics America

3.3V SUPERSYNC II 36BIT FIFO

26

SN74ABT3613-30PCB

SN74ABT3613-30PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 64X36, 15NS

899

72V3670L7-5PFGI

72V3670L7-5PFGI

Renesas Electronics America

IC FIFO SS 8192X36 7-5NS 128TQFP

0

CY7C460-15JI

CY7C460-15JI

Rochester Electronics

FIFO, 8KX9, 15NS, ASYNCHRONOUS

35

723641L15PFG8

723641L15PFG8

Renesas Electronics America

IC FIFO SYNC 1024X36 120-TQFP

0

SN74ACT7804-40DL

SN74ACT7804-40DL

Texas Instruments

FIFO, 512X18, 24NS, SYNCHRONOUS,

5493

SN74V273-15PZA

SN74V273-15PZA

Texas Instruments

16384 X 18 SYNCH FIFO MEMORY

1512

SN74ACT3632-20PCB

SN74ACT3632-20PCB

Texas Instruments

BI-DIRECTIONAL FIFO, 512X36

10

SN74ACT7882-30FN

SN74ACT7882-30FN

Texas Instruments

FIFO, 2KX18, 18NS, SYNCHRONOUS

741

CY7C460-40JI

CY7C460-40JI

Rochester Electronics

FIFO, 8KX9, 40NS, ASYNCHRONOUS

48

SN74ACT7808-40PAG

SN74ACT7808-40PAG

Texas Instruments

FIFO, 2KX9, 28NS, SYNCHRONOUS

1294

SN74ABT7820-15PH

SN74ABT7820-15PH

Texas Instruments

BI-DIRECTIONAL FIFO, 512X18

424

72V3670L10PFG

72V3670L10PFG

Renesas Electronics America

IC FIFO SS 8192X36 10NS 128-TQFP

0

72V221L10PFG8

72V221L10PFG8

Renesas Electronics America

IC FIFO SYNC 1KX9 10NS 32QFP

0

72V851L10PFG

72V851L10PFG

Renesas Electronics America

IC FIFO SYNC 4096X18 10NS 64QFP

0

72V205L10TFG

72V205L10TFG

Renesas Electronics America

IC FIFO SYNC 16KX9 10NS 64QFP

0

CY7C421-30VC

CY7C421-30VC

Rochester Electronics

FIFO, 512X9, 30NS, ASYNCHRONOUS

72

Logic - FIFOs Memory

1. Overview

FIFO (First-In-First-Out) memory is a specialized logic integrated circuit designed to store and manage data in a sequential queue structure. As a critical component in digital systems, FIFOs ensure data integrity by maintaining the order of data streams during transmission or buffering. Their importance spans across telecommunications, computing, industrial automation, and consumer electronics, where they resolve timing mismatches between system components, optimize data flow, and enhance overall efficiency.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
Synchronous FIFO Single clock domain for read/write operations; low latency CPU cache interconnects, high-speed data pipelines
Asynchronous FIFO Independent clock domains for read/write; metastability protection Cross-domain bridging in FPGAs, UART communication
Multi-port FIFO Supports multiple read/write ports with arbitration logic Network switches, parallel processing systems
Dual-Queue FIFO Separate memory banks for simultaneous access Real-time signal processing, AI accelerators

3. Structure and Composition

A typical FIFO memory integrates four core components: (1) Storage Array implemented with SRAM or DRAM cells for data retention; (2) Read/Write Pointers using Gray code counters to prevent race conditions; (3) Control Logic managing status flags (full/empty/half-full); and (4) Bus Interfaces supporting parallel or serial data transfer. Advanced designs incorporate error correction codes (ECC) and voltage regulation circuits for reliability in harsh environments.

4. Key Technical Specifications

Parameter Description
Storage Capacity Measured in bits/bytes (ranging from 256b to 128KB), determines buffer depth
Access Speed Maximum clock frequency (up to 1.2GHz) affecting data throughput
Power Consumption Typically 50-300mW; critical for battery-powered devices
Data Width Bus size (8/16/32/64 bits) matching host system requirements
Package Type Options: TSSOP, QFN, BGA for varying density/performance needs

5. Application Fields

Primary industries include:

  • Telecommunications: 5G base stations, optical transceivers
  • Industrial Automation: PLC controllers, sensor data aggregation systems
  • Consumer Electronics: Smartphones (camera ISPs), SSD controllers
  • Medical Devices: MRI image streaming processors
Case Study: In automotive LiDAR systems, FIFOs buffer high-speed point cloud data between laser sensors and SoC processors, ensuring zero data loss at 10Gbps rates.

6. Leading Manufacturers and Products

Manufacturer Representative Product Key Features
Texas Instruments SN74ACT7801 18-bit synchronous FIFO, 165MHz operation
STMicroelectronics STF2N60DM2 Dual-port FIFO with 2KB storage, automotive grade
NXP Semiconductors MC74LCX16500 16-bit asynchronous FIFO, 100MHz, low-voltage operation

7. Selection Guidelines

Key considerations include:

  1. Match storage capacity to burst data length requirements
  2. Verify access speed aligns with system clock domain constraints
  3. Assess power/performance trade-offs for mobile vs. fixed installations
  4. Choose synchronous/asynchronous type based on timing architecture
  5. Confirm package compatibility with PCB layout and thermal needs
For high-reliability applications, prioritize radiation-hardened variants with built-in test (BIST) capabilities.

8. Industry Trends

Emerging trends include:

  • 3D IC stacking for terabit-level FIFO densities
  • Integration with SerDes interfaces for 112Gbps+ data rates
  • Development of ultra-low-power FIFOs for IoT edge devices
  • Adoption of GDDR6/DDR5 memory interfaces in high-performance computing FIFOs
  • Standardization of FIFO IP cores in ASIC design toolchains
The global FIFO memory market is projected to grow at 6.8% CAGR through 2030, driven by 5G infrastructure and autonomous vehicle sensor networks.

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