Logic - Buffers, Drivers, Receivers, Transceivers

Image	Part Number	Description / PDF	Quantity	Rfq
	MC74ACT646DWR2 Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 24SOIC	0
	74LVC126ADR2G Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 14SOIC	0
	MC74LVX541DW Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 20SOIC	0
	74AC16244SSC Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 6V 48SSOP	0
	74ACTQ16543MTD Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 56TSSOP	0
	MC74HC540AFELG Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 6V SOEIAJ-20	0
	MC74ACT241MEL Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V SOEIAJ-20	0
	74VHCT245M Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20SOIC	0
	DM74AS646WMX Sanyo Semiconductor/ON Semiconductor	IC TRANSCEIVER INVERT 5.5V 24SOP	0
	MC74ACT640DW Sanyo Semiconductor/ON Semiconductor	IC TXRX INVERT 5.5V 20SOIC	0
	74ACT899QC Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 28PLCC	0
	74ACTQ18825MTD Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 56TSSOP	0
	DM74AS640WMX Sanyo Semiconductor/ON Semiconductor	IC TXRX INVERT 5.5V 20SOIC	0
	MM74HC540SJ Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 6V 20SOP	0
	MC74ACT240DW Sanyo Semiconductor/ON Semiconductor	IC BUFFER INVERT 5.5V 20SOIC	0
	74LCXZ245SJX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 20SOP	0
	MC74HCT541AN Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 5.5V 20DIP	0
	74LCX16646MEAX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 56SSOP	0
	74ABT245CMTCX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 20TSSOP	0
	74F657SPC Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 5.5V 24DIP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications