Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74HCT125PW-Q100118 NXP Semiconductors	IC BUF NON-INVERT 5.5V 14TSSOP	21440
74ABT2245D,112 NXP Semiconductors	IC TXRX NON-INVERT 5.5V 20SO	1520
74HC3G07DC,125 NXP Semiconductors	IC BUFFER NON-INVERT 6V 8VSSOP	9000
74AXP2G07GS125 NXP Semiconductors	74AXP2G07GS - BUFFER, AXP SERIES	4500
74LVCH244ADB,118 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 20SSOP	13116
74ALVT162245DGG112 NXP Semiconductors	BUS TRANSCVR, ALVT SERIES, 8-BIT	10625
74ALVCH16821DGG118 NXP Semiconductors	BUS DRIVER, ALVC/VCX/A SERIES	31014
74AUP2G241GF,115 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 8XSON	5000
74HCT240DB,118 NXP Semiconductors	IC BUFFER INVERT 5.5V 20SSOP	0
74LVC541AD-Q100118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	44000
74HC646N,652 NXP Semiconductors	IC TXRX NON-INVERT 6V 24DIP	4050
74LVC32245AEC,518 NXP Semiconductors	IC TXRX NON-INVERT 3.6V 96LFBGA	0
74LVC1G17GW/C4125 NXP Semiconductors	BUFFER, LVC/LCX/Z SERIES	3450
74LVTN16244BBX,518 NXP Semiconductors	IC BUF NON-INVERT 3.6V 60HXQFN	4800
74ALVCH16373DGG,118 NXP Semiconductors	NOW NEXPERIA 74ALVCH16373DGG - B	0
74AHC1G07GV-Q100125 NXP Semiconductors	BUFFER, AHC/VHC/H/U/V SERIES	177000
74HC9115D/S400118 NXP Semiconductors	IC BUFFER NON-INVERT 6V 20SO	1400
74HCT652D,112 NXP Semiconductors	IC TXRX NON-INVERT 5.5V 24SO	2836
74LVCH32244AEC,518 NXP Semiconductors	IC BUF NON-INVERT 3.6V 96LFBGA	31400
74AVC16835ADGV,112 NXP Semiconductors	IC BUF NON-INVERT 3.6V 56TSSOP	8850

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications