Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74AHC1G125GW-Q100125 NXP Semiconductors	BUS DRIVER, AHC/VHC/H/U/V SERIES	86702
74AHCT240PW-Q100118 NXP Semiconductors	BUS DRIVER, AHCT/VHCT/VT SERIES	2160
74AVC1T45GM-Q100125 NXP Semiconductors	BUS TRANSCEIVER, AVC SERIES	157076
74LV365D,118 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 16SO	0
74AVCM162836DGG118 NXP Semiconductors	BUS DRIVER, AVC SERIES	2000
74LVC125APW-Q100118 NXP Semiconductors	BUS DRIVER, LVC/LCX/Z SERIES	2440
74HCT541D118 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 20SO	2774
74HC540N-Q100112 NXP Semiconductors	IC BUFFER INVERT 6V 20DIP	1440
74LV125D,112 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 14SO	3629
74HC126PW112 NXP Semiconductors	IC BUFFER NON-INVERT 6V 14TSSOP	2183
74AUP1G07GX,125 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 5X2SON	76614
74HCT125N,652 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 14DIP	32563
74AUP1G240GM,115 NXP Semiconductors	IC BUF INVERT 3.6V 6XSON/SOT886	140000
74LVC2G17GS,132 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 6XSON	95949
74LVCH322245AEC557 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	41225
74LV241DB,112 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 20SSOP	1348
74LVCH322245AEC518 NXP Semiconductors	BUS TRANSCVR, LVC/LCX/Z SERIES	10500
74AXP1G17GS125 NXP Semiconductors	74AXP1G17GS - BUFFER, AXP SERIES	4500
74AUP2G126GF,115 NXP Semiconductors	IC BUFFER NON-INVERT 3.6V 8XSON	0
74HC243N,652 NXP Semiconductors	IC TXRX NON-INVERT 6V 14DIP	1905

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications