Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVC1G126SE-7 Zetex Semiconductors (Diodes Inc.)	IC BUF NON-INVERT 5.5V SOT353	0
SN74AHC244DWR Texas Instruments	IC BUF NON-INVERT 5.5V 20SOIC	5523
SN74ALS29861DWR Texas Instruments	BUS TRANSCEIVER, ALS SERIES	1000
SN74LVCH245ARGYRG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 20VQFN	0
AM2917AJC	BUS DRIVER/TRANSCVR, 4-BIT	12990
CY74FCT240TQCT Texas Instruments	CY74FCT240T OCTAL BUFFERS/DRIVER	15570
NLX3G16CMX1TCG	IC BUFFER NON-INVERT 5.5V 8ULLGA	18000
74AHC1G125GW-Q100H Nexperia	IC BUF NON-INVERT 5.5V 5TSSOP	2960
MC74HC125ADTR2G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 6V 14TSSOP	2147483647
SN74LVC240ANSR Texas Instruments	IC BUFFER INVERT 3.6V 20SO	2224
XC7SET125GV,125 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V SC74A	70211
SN74HCT652NT Texas Instruments	IC TXRX NON-INVERT 5.5V 24DIP	79271
SN74LVC125ARGYRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 14VQFN	0
SN74F543DBLE Texas Instruments	REGISTERED BUS TRANSCEIVER	900
74F827SC	IC BUFFER NON-INVERT 5.5V 24SOP	305
SNJ54HC534J Texas Instruments	BUS DRIVER, HC/UH SERIES	0
SN74LVC126ADBR Texas Instruments	IC BUFFER NON-INVERT 3.6V 14SSOP	72742
74ALVT16821DGG512 NXP Semiconductors	BUS DRIVER, ALVT SERIES, 10-BIT	875
MC74VHC1GT125EDFT2G Sanyo Semiconductor/ON Semiconductor	IC BUFFER NON-INVERT 5.5V SC88A	96000
54ACT374FM-MLS	BUS DRIVER, ACT SERIES, 1-FUNC,	527

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications