Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CD74HCT240EX	IC BUFFER INVERT 5.5V 20DIP	0
NL17SG125P5T5G	IC BUFFER NON-INVERT 3.6V SOT953	880000
74HC541D Toshiba Electronic Devices and Storage Corporation	IC BUFFER NON-INVERT 6V 20SOIC	2178
74LVT162244BDGG118 NXP Semiconductors	BUS DRIVER, LVT SERIES, 4-BIT	11533
CD74HC368E Texas Instruments	IC BUFFER INVERT 6V 16DIP	10170
74LVTH245MTCX Sanyo Semiconductor/ON Semiconductor	IC TXRX NON-INVERT 3.6V 20TSSOP	7247500
74AXP1T34GM125 NXP Semiconductors	74AXP1T34GM - BUFFER, AXP SERIES	0
5962-9314701Q2A Texas Instruments	BUS DRIVER, ABT SERIES	19
74ACT244MSA	IC BUFFER NON-INVERT 5.5V 20SSOP	3262
MC74HC244AFR1	IC BUF NON-INVERT 6V SOEIAJ-20	26000
SN74AHC245NS Texas Instruments	IC BUS TRANSCEIVER 8BIT 20SO	9760
SN74ABT240APWR Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	2558
N74F367N,602 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 16DIP	271
74LCX125MX Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 14SOIC	627
SN74ABT533N Texas Instruments	BUS DRIVER, ABT SERIES, 8-BIT	3040
SN74ABT2827DW Texas Instruments	IC BUF NON-INVERT 5.5V 24SOIC	345
MC74LCX125DTG Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 14TSSOP	98654624
SN74AUP1G125YZTR Texas Instruments	IC BUFFER NON-INVERT 3.6V 5DSBGA	99000
N74F126D,602 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 14SO	8007
SN74LVC1G34DPWR Texas Instruments	IC BUFFER NON-INVERT 5.5V 4X2SON	228000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications