Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74HCT240N,652 NXP Semiconductors	IC BUFFER INVERT 5.5V 20DIP	23975
74AUP1G07FZ4-7 Zetex Semiconductors (Diodes Inc.)	IC BUFFER NON-INVERT 3.6V 6DFN	884870000
74LVTH16244MTD	IC BUF NON-INVERT 3.6V 48TSSOP	4889
SN74ALS244BN3 Texas Instruments	BUS DRIVER, 4-BIT, TTL	779
74FCT244CTSOG8 Renesas Electronics America	IC BUF NON-INVERT 5.25V 20SOIC	0
SN74BCT241N Texas Instruments	IC BUFFER NON-INVERT 5.5V 20DIP	8920
SN74F245DWE4	IC TXRX NON-INVERT 5.5V 20SOIC	585
CD74FCT541CTM	BUS DRIVER, FCT SERIES	3030
MC74VHCT244AM	BUS DRIVER, AHCT/VHCT SERIES	0
SN74ALS651-1NT3 Texas Instruments	BUS TRANSCEIVER, ALS SERIES	240
74HCT241D/C118 NXP Semiconductors	IC BUFFER NON-INVERT 5.5V 20SO	2000
CD74HC240E Texas Instruments	IC BUFFER INVERT 6V 20DIP	6623
CY74FCT16646TPVCT Texas Instruments	IC TXRX NON-INVERT 5.5V 56SSOP	7850
74LVT162244BDGG:11 Nexperia	IC BUF NON-INVERT 3.6V 48TSSOP	1040
74LVC1G34GF,132 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	2366
DM74S241J	BUS DRIVER, 4-BIT, TTL	16407
SN74LVCH245ADW Texas Instruments	IC TXRX NON-INVERT 3.6V 20SOIC	924
MC74VHCT240ADTR2	IC BUFFER INVERT 5.5V 20TSSOP	7500
SN74CBT3384DWR Texas Instruments	BUS DRIVER	20846
74HCT125PW-Q100J Nexperia	IC BUF NON-INVERT 5.5V 14TSSOP	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications