Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74LVX240MX	IC BUFFER INVERT 3.6V 20SOIC	33425
74AUP1G17SE-7 Zetex Semiconductors (Diodes Inc.)	IC BUF NON-INVERT 3.6V SOT353	7082
74LVC2G126GN,115 Nexperia	IC BUFFER NON-INVERT 5.5V 8XSON	0
74HCT244PW,118 Nexperia	IC BUF NON-INVERT 5.5V 20TSSOP	3018
CD74FCT16543ETSM	FAST 16-BIT LATCHED TRANSCEIVER	1914
MC14503BCPG	IC BUFFER NON-INVERT 18V 16DIP	5282
74ACT245PC	IC TXRX NON-INVERT 5.5V 20DIP	22815
74F243SCX	BUS TRANSCEIVER	0
CD4010BEE4	IC BUFFER NON-INVERT 18V 16DIP	950
MC74HC367ADT	IC BUFFER NON-INVERT 6V 16TSSOP	2329
74HC365PW,112 Nexperia	IC BUFFER NON-INVERT 6V 16TSSOP	8474
SN74ACT373NE4 Texas Instruments	BUS DRIVER, ACT SERIES, 1-FUNC,	0
TC74AC640FTEL Toshiba Electronic Devices and Storage Corporation	IC TXRX INVERT 5.5V 20TSSOP	0
74AUP2G07GFX Nexperia	IC BUFFER NON-INVERT 3.6V 6XSON	9670
74ALVCH162244DGG112 NXP Semiconductors	BUS DRIVER	1590
74LVTH16244ADGGRE4 Texas Instruments	IC BUF NON-INVERT 3.6V 48TSSOP	0
MC74LCX540DTR2G	IC BUFFER INVERT 3.6V 20TSSOP	11650
SN74AUP3G34DQER Texas Instruments	IC BUF NON-INVERT 3.6V 8X2SON	0
74FCT574ASC	BUS DRIVER, FCT SERIES	53
SN74LVC1G07YEPR Texas Instruments	IC BUFFER NON-INVERT 5.5V 5DSBGA	18000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications