Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
QS54FCT2374ATDB	IC TRANSCEIVER NON-INVERT 5V	223
CY74FCT16245ETPVC Texas Instruments	BUS TRANSCEIVER, FCT SERIES	10331
IMIB9946CA Rochester Electronics	CLOCK FANOUT BUFFER 10-OUT 32PIN	1802
74ACT16541DL Texas Instruments	IC BUF NON-INVERT 5.5V 48SSOP	250
SN74LV244ATRGYR Texas Instruments	IC BUFFER NON-INVERT 5.5V 20VQFN	19000
74LVT2241D,118 Nexperia	IC BUFFER NON-INVERT 3.6V 20SO	0
SN74ABT2952ADW Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	21261
5962-9469701QRA Texas Instruments	SN54ABT2240A OCTAL BUFFERS AND L	15
TC7SH126FU,LJ(CT Toshiba Electronic Devices and Storage Corporation	IC BUFFER NON-INVERT 5.5V USV	980
CD74HCT244E Texas Instruments	IC BUF NON-INVERT 5.5V 20DIP	2099
74AXP2G34GSH NXP Semiconductors	IC BUFFER NON-INVERT 2.75V 6XSON	4180
SN74LVC1G17YEPR Texas Instruments	IC BUFFER NON-INVERT 5.5V 5DSBGA	2900
74LVT244SJ	IC BUFFER NON-INVERT 3.6V 20SOP	14856
SN74ABT2245DBR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SSOP	1800
SNJ54F374J Texas Instruments	54F374 OCTAL EDGE-TRIGGERED D-TY	225
74LVC16244ADL,112-NEX Nexperia	IC BUFFER NON-INVERT 3.6V 48SSOP	0
74AHCT1G125GM,115 Nexperia	IC BUFFER NON-INVERT 5.5V 6XSON	95000
SNJ54AHC244FK Texas Instruments	54AHC244 OCTAL BUFFERS/DRIVERS W	5
SN74ABT620DBR Texas Instruments	IC TXRX INVERT 5.5V 20SSOP	2000
74LVC2G07GW132 Nexperia	BUFFER, LVC/LCX/Z SERIES, 2 FUN	105000

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications