Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
CY74FCT244ATSOCT Texas Instruments	CY74FCT244T OCTAL BUFFERS AND LI	24258
SN74AVC16646DGG Texas Instruments	REGISTERED BUS TRANSCEIVER	1121
CY74FCT16823ATPAC Rochester Electronics	BUS DRIVER, FCT SERIES, 2 FUNC,	7844
MC74VHCT244AMELG	IC BUF NON-INVERT 5.5V SOEIAJ-20	38000
SN74HCT125NG4 Texas Instruments	IC BUF NON-INVERT 5.5V 14DIP	0
MC74F543N	REGISTERED BUS TRANSCEIVER, F/FA	2874
74FCT162245CTPACT Texas Instruments	IC TXRX NON-INVERT 5.5V 48TSSOP	16000
FST3244WM	BUS DRIVER	15725
SN74LS645DWG4	IC TXRX NON-INVERT 5.25V 20SOIC	0
NC7SP17FHX Sanyo Semiconductor/ON Semiconductor	IC BUF NON-INVERT 3.6V 6MICROPK2	3941
74VCX16240MTDX	IC BUFFER INVERT 3.6V 48TSSOP	3000
SN74LVC1G126YZAR Texas Instruments	IC BUFFER NON-INVERT 5.5V 5DSBGA	0
74HC126D-Q100J Nexperia	IC BUFFER NON-INVERT 6V 14SO	0
74AC11245DWR Texas Instruments	IC TXRX NON-INVERT 5.5V 24SOIC	3000
SN74LVC2244ADWRG4 Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	0
74LVCH16543APAG8 Renesas Electronics America	IC TXRX NON-INVERT 3.6V 56TSSOP	0
74ALVC245BQ,115 Nexperia	IC TXRX NON-INVERT 3.6V 20DHVQFN	515
SN54LS241J Texas Instruments	54LS241 OCTAL BUFFERS AND LINE D	952
74VHCT125D,118 Nexperia	IC BUFFER NON-INVERT 5.5V 14SO	2199
M74HC365YRM13TR STMicroelectronics	IC BUFFER NON-INVERT 6V 16SO	0

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications