Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
SN74LVC245ANG4 Texas Instruments	IC TXRX NON-INVERT 3.6V 20DIP	0
SN74LVTH16541DGG Texas Instruments	BUS DRIVER, LVT SERIES, 8-BIT	5800
QS74FCT162373CTPA	IC BUS INTERFACE/TXRX 5V	4177
SN74AUC2G07DBVR Texas Instruments	IC BUF NON-INVERT 2.7V SOT23-6	1950
SN74ABTH245N Texas Instruments	IC TXRX NON-INVERT 5.5V 20DIP	80150
SN74HC244DW Texas Instruments	IC BUFFER NON-INVERT 6V 20SOIC	5582
CD4050BF	HEX INVERTING BUFFER/CONVERTER	18
SN74LV125ATDBR Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SSOP	23566
5962-9686401QSA Texas Instruments	SN54AHC374 OCTAL EDGE-TRIGGERED	22
BTS149E3045ANTMA1 IR (Infineon Technologies)	BUFFER/INVERTER PERIPHL DRIVER	0
CY74FCT244DTQCT Texas Instruments	IC BUF NON-INVERT 5.25V 20SSOP	16989
SN74LVCH16541ADL Texas Instruments	IC BUFFER NON-INVERT 3.6V 48SSOP	4254
74FCT162245TPV	16-BIT BIDIRECTIONAL TRANSCEIVER	45221
SN74HC365PWR Texas Instruments	IC BUFFER NON-INVERT 6V 16TSSOP	1404
SN74AHC245DW Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	64
SN74LVC1G126DRLR Texas Instruments	IC BUFFER NON-INVERT 5.5V SOT5	31949
SN74AHC126DBR Texas Instruments	IC BUFFER NON-INVERT 5.5V 14SSOP	54750
74HCT245BQ-Q100X Nexperia	IC TXRX NON-INVERT 5.5V 20DHVQFN	0
NC7SZ125P5X	BUS DRIVER, LVC/LCX/Z SERIES, 1-	702691
SN74ALVCH16374DGG Texas Instruments	BUS DRIVER, ALVC/VCX/A SERIES	2775

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications