Logic - Buffers, Drivers, Receivers, Transceivers

Part Number	Description / PDF	Quantity
74ABT646CMSA	IC TXRX NON-INVERT 5.5V 24SSOP	2610
SN74ABT125PWRE4 Texas Instruments	IC BUF NON-INVERT 5.5V 14TSSOP	0
74AXP2G07GN125 NXP Semiconductors	74AXP2G07GN - BUFFER, AXP SERIES	4500
QS74FCT2373CTP	IC ADDRESS DRIVER 5V TELECOM	470
SN74LS640-1DW Texas Instruments	IC TXRX INVERT 5.25V 20SOIC	319
SN74LV245ADWR Texas Instruments	IC TXRX NON-INVERT 5.5V 20SOIC	1189
CD74HCT240E	IC BUFFER INVERT 5.5V 20DIP	19731
74HC126PW,118 Nexperia	IC BUFFER NON-INVERT 6V 14TSSOP	386
SN74ALVTH162827LR Texas Instruments	IC BUFFER NON-INVERT 3.6V 56SSOP	6000
SN74LVC2G17YEAR Texas Instruments	IC BUFFER NON-INVERT 5.5V 6DSBGA	6000
NC7SZ125M5	BUS DRIVER, LVC/LCX/Z SERIES, 1	462360
74HCT240D,653 Nexperia	IC BUFFER INVERT 5.5V 20SO	7398
SN74ALVC244DWR Texas Instruments	IC BUF NON-INVERT 3.6V 20SOIC	14715
74LVCH244ABQ-Q100X Nexperia	IC BUF NON-INVERT 3.6V 20DHVQFN	0
SN74ACT240PWRG4 Texas Instruments	IC BUFFER INVERT 5.5V 20TSSOP	5300
SN74LS642-1DW Texas Instruments	IC TXRX INVERT 5.25V 20SOIC	7
SN74ABT162245DLG4 Texas Instruments	IC TXRX NON-INVERT 5.5V 48SSOP	0
AM29843DMB	BUS DRIVER, S SERIES, 9-BIT	79
CD74HCT243M Texas Instruments	IC TXRX NON-INVERT 5.5V 14SOIC	0
AM29828APC	BUS DRIVER, S SERIES, 10-BIT	1022

Logic - Buffers, Drivers, Receivers, Transceivers

1. Overview

Logic buffers, drivers, receivers, and transceivers are fundamental components in digital circuits designed to manage signal integrity, level shifting, and electrical isolation. These ICs ensure reliable data transmission between devices with varying voltage levels, drive capabilities, or noise environments. They play a critical role in modern electronics, including computers, communication systems, industrial automation, and automotive electronics.

2. Main Types and Functional Classification

Type	Functional Characteristics	Application Examples
Buffers	Signal replication and drive strength enhancement without inversion	Memory address lines, clock distribution networks
Drivers	High-current output for capacitive/inductive loads	Motor controllers, LED displays
Receivers	Signal conditioning and voltage-level translation	RS-485 interfaces, sensor signal processing
Transceivers	Bidirectional signal conversion with isolation	USB interfaces, CAN bus systems

3. Structure and Composition

These ICs typically feature:

Standard packages: DIP, SOIC, TSSOP, QFN
Internal circuitry: CMOS/Bipolar transistors, ESD protection diodes
Power rails: Separate VCC/GND for noise isolation
I/O structures: Schmitt-trigger inputs, tri-state outputs

4. Key Technical Specifications

Parameter	Description	Importance
Data Rate	Maximum signal switching frequency (Mbps/Gbps)	Determines communication speed
Supply Voltage	Operating voltage range (e.g., 1.65-5.5V)	Compatibility with system power
Drive Strength	Output current capability ( 24mA typical)	Load driving capacity
Propagation Delay	Signal transmission time (ns range)	Timing critical applications
ESD Rating	Electrostatic discharge tolerance (kV)	Reliability in harsh environments

5. Application Fields

Telecommunications: Base stations, optical modules
Industrial Automation: PLCs, fieldbus interfaces
Consumer Electronics: Smartphones, SSD controllers
Automotive: CAN transceivers, sensor hubs
Aerospace: Avionics data links

6. Leading Manufacturers and Products

Manufacturer	Key Products	Features
TI	SN74LVC245A	8-bit bus transceiver, 64MHz, 1.65-3.6V
STMicro	L6384E	High-side driver with protection features
NXP	TJA1050	High-speed CAN transceiver
ON Semi	MC74VHC1GT45	Low-voltage translator, 125MHz

7. Selection Guidelines

Match voltage levels between source and destination
Calculate required drive current ( IOL/IOH)
Consider package thermal characteristics
Select appropriate ESD protection level
Evaluate timing requirements (tPD, skew)
Verify industrial/automotive temperature ratings

8. Industry Trends

Increasing integration of protocol-specific transceivers
Sub-1V core voltage compatibility
EMI reduction through slew-rate control
Automotive-grade SiC/GaN driver development
AI-driven dynamic power optimization
Adoption of 3D packaging for high-density applications