| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
ROHM Semiconductor |
IC BRIDGE DRIVER PAR 28HSOP |
1492 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D MONO 850MW 9VCSP |
1708 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D STER 20W 44HTSSOP |
0 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D STER 10W 44HTSSOP |
0 |
|
 |
ROHM Semiconductor |
IC AMP CLASS AB STEREO 5W 15HSIP |
83 |
|
 |
ROHM Semiconductor |
IC AMP AB STEREO 80MW VCSP50L2 |
2994 |
|
 |
ROHM Semiconductor |
IC AMP CLASS AB STEREO 8SOP |
2271 |
|
 |
ROHM Semiconductor |
IC AMP D STEREO 10W HTSSOP-B54 |
1453 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D MONO 700MW 9VCSP |
2890 |
|
 |
ROHM Semiconductor |
IC AMP D STEREO 10W VQFN048V7070 |
0 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D MONO 2.5W 8VSON |
3804 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D STER 15W 28HTSSOP |
0 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D STEREO 24BGA |
522 |
|
 |
ROHM Semiconductor |
IC AMP CLASS AB MONO 500MW 8MSOP |
2538 |
|
 |
ROHM Semiconductor |
IC AMP D STEREO 20W VQFN024V4040 |
1574 |
|
 |
ROHM Semiconductor |
IC AMP CLASS AB STEREO 62MW 8SOP |
2480 |
|
 |
ROHM Semiconductor |
IC AMP AB STEREO 80MW VCSP50L2 |
3000 |
|
 |
ROHM Semiconductor |
IC AMP D STEREO 9W VQFN032V5050 |
1927 |
|
 |
ROHM Semiconductor |
IC AMP CLASS D STER 10W 44HTSSOP |
2582 |
|
 |
ROHM Semiconductor |
IC AMP AB STEREO 80MW VCSP50L2 |
2998 |
|
Linear audio amplifiers are electronic devices designed to amplify low-level audio signals while maintaining signal integrity and minimizing distortion. They operate in the linear region of transistor characteristics, ensuring high-fidelity sound reproduction. These amplifiers are critical in audio systems for applications ranging from consumer electronics to professional audio equipment, enabling clear sound amplification in devices such as smartphones, home theaters, and musical instruments.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Class AB Amplifiers | Combines efficiency of Class B with low distortion of Class A | Home audio systems, guitar amplifiers |
| Class D Amplifiers | Switching amplifiers with high power efficiency (typically >90%) | Portable speakers, automotive audio systems |
| Class G/H Amplifiers | Uses multiple power rails to improve efficiency | Professional audio mixers, high-power amplifiers |
| Class A Amplifiers | Full-cycle conduction with minimal distortion | High-end audiophile equipment, preamplifiers |
Typical linear audio amplifiers consist of: - Input Stage: Differential amplifier for signal reception - Gain Stage: Voltage amplification using transistors or op-amps - Output Stage: Push-pull configuration for power delivery - Power Supply: Symmetrical voltage rails ( Vcc) - Thermal Management: Heat sinks or thermal pads for power dissipation Packaged in DIP, SOIC, or surface-mount (SMT) formats with 8-14 pins.
| Parameter | Description | Importance |
|---|---|---|
| Gain Bandwidth Product (GBW) | Product of amplifier gain and operational bandwidth | Determines frequency response capability |
| Total Harmonic Distortion + Noise (THD+N) | Measure of signal distortion and noise | Indicates audio quality (typically <0.1%) |
| Output Power | Maximum power delivered to load (Watts) | Defines application suitability (e.g., 2x15W for stereo) |
| Power Supply Rejection Ratio (PSRR) | Ability to reject power supply noise | Impacts noise immunity (typically >60dB) |
| Quiescent Current | Current consumption at no-load condition | Affects power efficiency and thermal design |
| Manufacturer | Representative Product | Key Specifications |
|---|---|---|
| TI (Texas Instruments) | TPA3255 | 2x75W Class D amplifier, 102dB PSRR |
| STMicroelectronics | TDA7294 | 100W Hi-Fi amplifier, DMOS output stage |
| Analog Devices | AD822 | Low noise JFET input amplifier |
| NXP Semiconductors | TDA1541A | 192kHz DAC with integrated headphone amplifier |
Key considerations for selection: 1. Application Requirements: Output power, frequency range, and load impedance 2. Power Supply Constraints: Available voltage/current capacity 3. Thermal Management: Operating temperature range and cooling methods 4. Form Factor: Package size for PCB integration 5. Cost vs. Performance: Balancing THD+N, efficiency, and budget
Future developments include: - Increased integration with digital signal processing (DSP) - Adoption of GaN (Gallium Nitride) technology for higher efficiency - Development of AI-powered noise cancellation algorithms - Miniaturization through 3D packaging techniques - Enhanced Class D amplifier designs with reduced electromagnetic interference (EMI)