Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
AD8180ANZ

AD8180ANZ

Analog Devices, Inc.

VIDEO MULTIPLEXER,2 CHANNEL

27016

VSC7514XKS

VSC7514XKS

Roving Networks / Microchip Technology

IC ETHERNET SWITCH 10-PORT

0

MAX7358ETG+

MAX7358ETG+

Maxim Integrated

IC MULTIPLEXER 8X1 24TQFN

2025

TS3USB221EDRCR

TS3USB221EDRCR

Texas Instruments

IC USB SWITCH DUAL 1X2 10-SON

193

LT6556IGN#PBF

LT6556IGN#PBF

Analog Devices, Inc.

IC VIDEO MULTIPLEXER 2X1 24SSOP

0

MAX4570CAI+

MAX4570CAI+

Maxim Integrated

IC CROSSPOINT SWITCH DUAL 28SSOP

18552

TS5USBC402IYFPT

TS5USBC402IYFPT

Texas Instruments

DUAL 2:1 USB 2.0 MUX/DEMUX OR SI

68

SN102685P

SN102685P

Texas Instruments

ANALOG INTERFACE

8800

NCN3612BMTTWG

NCN3612BMTTWG

DIFFERENTIAL MUX, 6 CHANNEL

4000

SN104000D

SN104000D

Texas Instruments

ANALOG INTERFACE

11800

HD3SS3412ARUAT

HD3SS3412ARUAT

Texas Instruments

HD3SS3412ARUAT

571

PI3L110QEX

PI3L110QEX

Zetex Semiconductors (Diodes Inc.)

IC ETHERNET SWITCH QUAD 16QSOP

0

MAX7368EUE+T

MAX7368EUE+T

Maxim Integrated

IC MULTIPLEXER DUAL 4X1 16TSSOP

2500

ISL54220IUZ-T

ISL54220IUZ-T

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL SPDT 10MSOP

2500

TS5USBA224RSWR

TS5USBA224RSWR

Texas Instruments

IC SW USB/AUDIO DPDT 10UQFN

8376

MAX4906ELB+T

MAX4906ELB+T

Maxim Integrated

IC USB SWITCH DUAL 1X2 10UDFN

13172500

FSAV430BQX

FSAV430BQX

AUDIO/VIDEO SWITCH

350044

FSUSB74UMX

FSUSB74UMX

Sanyo Semiconductor/ON Semiconductor

IC USB MUX/SWITCH 16UMLP

0

ISL54222AIRTZ-T

ISL54222AIRTZ-T

Intersil (Renesas Electronics America)

IC MULTIPLEXER DUAL 2X1 10TDFN

0

AD8193ACPZ

AD8193ACPZ

Analog Devices, Inc.

AUDIO/VIDEO SWITCH, 2 CHANNEL

25799

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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