Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
FSAV330QSC

FSAV330QSC

AUDIO/VIDEO SWITCH

9120

TS3L100RGYR

TS3L100RGYR

Texas Instruments

IC ETHERNET SWITCH QUAD 16VQFN

2410

CBTL08GP053EVY

CBTL08GP053EVY

NXP Semiconductors

IC MUX CROSSBAR SW USB VFBGA40

8106

ISL54226IRTZ-T7A

ISL54226IRTZ-T7A

Intersil (Renesas Electronics America)

IC USB SWITCH DPST OVP 8TDFN

0

PI3DBS12412ZLE

PI3DBS12412ZLE

Zetex Semiconductors (Diodes Inc.)

IC MUX/DEMUX 2:1 12GBPS

0

PI3WVR12612ZLEX

PI3WVR12612ZLEX

Zetex Semiconductors (Diodes Inc.)

IC VIDEO SWITCH HDMI 52TQFN

0

PI3USB31531ZLCEX

PI3USB31531ZLCEX

Zetex Semiconductors (Diodes Inc.)

IC USB3 SWITCH W-QFN3060-40

717

FSAV450MTC

FSAV450MTC

AUDIO/VIDEO SWITCH

1779

FSUSB20MUX

FSUSB20MUX

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DUAL 2X1 10MSOP

6200

MAX4899EETE+T

MAX4899EETE+T

Maxim Integrated

IC MULTIPLEXER DUAL 3X1 16TQFN

7500

ISL54200IRZ-T

ISL54200IRZ-T

Intersil (Renesas Electronics America)

IC USB SWITCH DUAL SPDT 10TDFN

0

ADG2108BCPZ-REEL7

ADG2108BCPZ-REEL7

Analog Devices, Inc.

CROSS POINT SWITCH, 1 FUNC, 10 C

7364

NX3DV221GM,132

NX3DV221GM,132

NXP Semiconductors

IC USB 2.0 SWITCH HS 10XQFN

5845

VSC3316YYP

VSC3316YYP

Roving Networks / Microchip Technology

IC CROSSPOINT SWITCH 16X16

153

FSA203MTCX

FSA203MTCX

DPDT, PDSO20

17187

LT6555CUF#PBF

LT6555CUF#PBF

Analog Devices, Inc.

IC VIDEO MULTIPLEXER 2X1 24QFN

762

ISL54208IRUZ-T

ISL54208IRUZ-T

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, PQCC10

11677

HI1-0524-5

HI1-0524-5

Intersil (Renesas Electronics America)

4-CHANNEL VIDEO MUX

2653

MAX4567EEE+T

MAX4567EEE+T

Maxim Integrated

IC VIDEO SWITCH DUAL SPDT 16QSOP

0

FSAV331QSC

FSAV331QSC

VIDEO MULTIPLEXER

13996

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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