Interface - Analog Switches - Special Purpose

Image Part Number Description / PDF Quantity Rfq
HD3SS3212RKSTQ1

HD3SS3212RKSTQ1

Texas Instruments

MULTIPLEXER

550

ISL54402IRUZ-T

ISL54402IRUZ-T

Intersil (Renesas Electronics America)

SPDT, 2 FUNC, 1 CHANNEL, CMOS

90000

HV2201FG-G

HV2201FG-G

Roving Networks / Microchip Technology

IC ULTRASOUND SWITCH 1:1 48LQFP

210

NX5DV330D,118

NX5DV330D,118

NXP Semiconductors

IC VIDEO MUX/DEMUX 1X2 16SOIC

9354

FSUSB23L10X

FSUSB23L10X

DIFFERENTIAL MUX, 2 CHANNEL

91169

NLAS7222BMUTBG

NLAS7222BMUTBG

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH DPDT 10UQFN

1322

MAX4903ETA+T

MAX4903ETA+T

Analog Devices, Inc.

MAX4903 LOW-RON, SINGLE-SPDT CLI

20765

PI3L110LE

PI3L110LE

Zetex Semiconductors (Diodes Inc.)

IC ETHERNET SWITCH QUAD 16TSSOP

1

TUSB1146IRNQT

TUSB1146IRNQT

Texas Instruments

USB TYPE C REDRIVER /MUX

245

FSUSB43L10X-F131

FSUSB43L10X-F131

LOW POWER, TWO-PORT, HI-SPEED, U

5000

HV2708T-C/R8X

HV2708T-C/R8X

Roving Networks / Microchip Technology

16-CH 200V NO HV BIAS SWITCH SPS

784

FSUSB30MUX

FSUSB30MUX

Sanyo Semiconductor/ON Semiconductor

IC USB SWITCH 2X2 10MSOP

228

FSUSB74MPX

FSUSB74MPX

Sanyo Semiconductor/ON Semiconductor

IC USB MUX/SWITCH 16MLP

0

MAX7356EUG+

MAX7356EUG+

Maxim Integrated

IC MULTIPLEXER 8X1 24TSSOP

1106138

LMH6570MA/NOPB

LMH6570MA/NOPB

Texas Instruments

IC VIDEO MULTIPLEXER SPST 8SOIC

337

MAX4889CETO+

MAX4889CETO+

Maxim Integrated

IC SWITCH OCTAL SPDT 42TQFN

2880

AD8189ARUZ-RL

AD8189ARUZ-RL

Analog Devices, Inc.

IC MULTIPLEXER TRPL 2X1 24TSSOP

0

HV2221FG-G

HV2221FG-G

Roving Networks / Microchip Technology

IC ULTRASOUND SWITCH 1:1 48LQFP

474

PI5V330WE

PI5V330WE

Zetex Semiconductors (Diodes Inc.)

IC VIDEO MUX/DEMUX 2X1 16SOIC

1

TS3V330PW

TS3V330PW

Texas Instruments

IC MUX/DEMUX VID SW QUAD 16TSSOP

553

Interface - Analog Switches - Special Purpose

1. Overview

Special Purpose Analog Switches are semiconductor devices designed to route analog signals in specialized applications where standard switches cannot meet specific performance requirements. These ICs use MOSFET-based structures to control signal paths with optimized parameters for voltage range, frequency response, and signal integrity. Their importance in modern electronics stems from enabling precise signal management in critical systems like medical imaging, industrial automation, and high-frequency communication equipment.

2. Major Types and Functional Classification

TypeFunctional FeaturesApplication Examples
High-Voltage SwitchesOperate at >20V, enhanced isolationPower supply switching in test equipment
High-Frequency SwitchesGHz-range operation, low capacitanceRF signal routing in 5G infrastructure
Precision SwitchesUltra-low leakage (pA range), minimal distortionMedical diagnostic equipment sensors
High-Current SwitchesHandles >1A continuous currentIndustrial motor control systems

3. Structure and Composition

Typical architecture includes:

  • CMOS/Trench MOSFET switching elements
  • Digital control logic with level shifting
  • ESD protection structures (TVS diodes)
  • Dielectrically isolated signal paths
  • Advanced packaging (QFN, TSSOP, BGA)

Specialized variants incorporate materials like gallium nitride (GaN) for high-power applications and silicon-on-insulator (SOI) for RF performance optimization.

4. Key Technical Specifications

ParameterDescriptionImportance
RON (On-Resistance)Resistance in conducting stateAffects signal attenuation and power loss
IOFF (Off-Leakage)Current in non-conducting stateDetermines signal isolation quality
BandwidthFrequency range of effective operationLimits maximum usable signal rate
Voltage RangeOperating voltage limitsDefines system compatibility
Switching SpeedTransition time between statesImpacts real-time control capabilities

5. Application Fields

  • Telecommunications: Optical transceiver signal routing
  • Medical Equipment: MRI scanner signal multiplexing
  • Industrial Automation: PLC analog signal switching
  • Test & Measurement: Automatic test equipment (ATE) matrix switches
  • Automotive: Battery management system signal control

6. Leading Manufacturers and Products

ManufacturerProduct FamilyKey Specifications
TI (Texas Instruments)TS5A231575V, 1 RON, 40MHz bandwidth
Analog DevicesADG541244V, 150 RON, -40 C to +125 C
NXP SemiconductorsPCA9546AI2C-controlled, 4-channel, 5.5V
Maxim IntegratedMAX4735High-current, 1A rating

7. Selection Guidelines

Key considerations include:

  • Signal voltage/current requirements
  • Operating environment (temperature, vibration)
  • Parasitic capacitance for high-speed applications
  • Package type vs. board space constraints
  • Control interface compatibility (GPIO, I2C, SPI)
  • Cost vs. reliability trade-offs

8. Industry Trends Analysis

Current development directions include:

  • Miniaturization: 0.4mm pitch WLCSP packaging
  • Integration: Switches with built-in diagnostic functions
  • Wide Bandgap Materials: GaN/SiC-based switches for power applications
  • Smart Switching: Embedded digital control algorithms
  • Energy Efficiency: Sub- A quiescent current designs

Market growth is driven by 5G infrastructure (25% CAGR in RF switches) and EV battery management systems requiring high-voltage switching.

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