Embedded - PLDs (Programmable Logic Device)

Part Number	Description / PDF	Quantity
EP610LI-25 Rochester Electronics	EP610LI-25	1332
EP1810LI-45 Rochester Electronics	OT PLD, 50NS, CMOS, PQCC68	1319
PALCE22V10-5PC Rochester Electronics	FLASH PLD, 5NS, PAL-TYPE	2691
EP1810GI-35 Rochester Electronics	UV PLD, 35NS, CPGA68	150
EP610DM-35/B Rochester Electronics	LOGIC (EPLD)	165
5962-87539013A Rochester Electronics	UV PLD, 25NS, PAL-TYPE, CMOS	227
EP610PC-25T Rochester Electronics	OT PLD, 27NS, CMOS, PDIP24	71
EP1810LI-35 Rochester Electronics	OT PLD, 35NS, PQCC68	332
EP610DC-35 Rochester Electronics	UV PLD, 37NS, CMOS, CDIP24	120
PALCE16V8-25JI Rochester Electronics	FLASH PLD, 25NS, PAL-TYPE	4233
EP610LI-20 Rochester Electronics	OT PLD, 22NS, CMOS, PQCC28	450
EP610PC-30 Rochester Electronics	OT PLD, 32NS, CMOS, PDIP24	335
EP1800ILC-70 Rochester Electronics	OT PLD, 70NS, 48-CELL, CMOS, PQC	767
EP1810GM/B Rochester Electronics	COMPLEX EPLD	0
PAL16L8-7PC Rochester Electronics	OT PLD, 10NS, TTL, PDIP20	1614
PAL20L10-25MJT/B Rochester Electronics	PLD	385
EP1800GM-75/B Rochester Electronics	EP1800GM-75/B	191
PALC22V10-25JCB Rochester Electronics	ELECTRICALLY ERASABLE PAL DEVIC	49
EP900DM/B Rochester Electronics	EP900DM/B	1200

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA (Field-Programmable Gate Array)	High logic density, reconfigurable architecture, supports complex parallel processing	5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)	Non-volatile memory, deterministic timing, lower logic density than FPGAs	Automotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)	One-time programmable (OTP) or reprogrammable, simple logic implementation	Legacy system upgrades, low-cost IoT sensors
SoC PLD	Integrated processor cores with programmable logic	Smart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cell Count	Total number of programmable logic units	Determines implementation complexity
Maximum Operating Frequency	Up to 1 GHz in advanced FPGAs	Defines processing speed capability
Power Consumption	Measured in mW/MHz	Critical for battery-powered devices
Voltage Requirements	Typically 1.0V-3.3V	Impacts system power design
Package Type	BGA, QFN, TQFP	Affects PCB layout and thermal management
Temperature Range	-40 C to +125 C (industrial grade)	Determines operational environment suitability

5. Application Areas

Telecommunications: 5G NR signal processing, network packet switching
Automotive: ADAS sensor fusion, vehicle network gateways
Industrial: CNC machine control, industrial Ethernet protocols
Consumer: Display timing controllers, wearable device interfaces
Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx (AMD)	XCVU9P FPGA	2.5M logic cells, 58Gbps transceivers
Intel	Stratix 10 MX	1.9M logic elements, 4GB HBM2 memory
Microchip	SmartFusion2	150K logic cells, ARM Cortex-M3 processor
Lattice Semiconductor	LatticeECP5	103K LUTs, 1.5W power consumption

7. Selection Guidelines

Evaluate required logic density and I/O count
Compare power efficiency metrics (mW/GHz)
Assess toolchain capabilities (HDL support, simulation tools)
Consider temperature and reliability requirements
Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.