Embedded - PLDs (Programmable Logic Device)

Part Number	Description / PDF	Quantity
CY7C332-20QMB Rochester Electronics	UV PLD, 25NS, PAL-TYPE	86
EP910LC-35 Rochester Electronics	OT PLD, 38NS, CMOS, PQCC44	330
EP600DM-25/B Rochester Electronics	ROCHESTER MANUFACTURED EP610, LO	25
EP610PC-35 Rochester Electronics	OT PLD, 37NS, CMOS, PDIP24	1553
EP610LC-35 Rochester Electronics	OT PLD, 37NS, CMOS, PQCC28	1480
EP910DI-35 Rochester Electronics	UV PLD, 38NS, CMOS, CDIP40	641
PALC16R4-35WC Rochester Electronics	UV PLD, 35NS, PAL-TYPE	85
EP910LI-30 Rochester Electronics	OT PLD, 30NS, PQCC44	1109
5962-9176009M3A Rochester Electronics	NVSRAM - DUAL MARKED (22V10)	400
CY7C341-30HMB Rochester Electronics	UV PLD, 59NS, 192-CELL CQCC84	62
EP610SC-20 Rochester Electronics	OT PLD, 22NS, CMOS, PDSO24	1531
EP910LC-40 Rochester Electronics	OT PLD, 43NS, CMOS, PQCC44	163
AMPAL20L10APC Rochester Electronics	TYPE, TTL, PDIP24	1181
EP1810GC-35 Rochester Electronics	UV PLD, 40NS, CMOS, CPGA68	27
EP910PI-35 Rochester Electronics	OT PLD, 38NS, CMOS, PDIP40	2493
EP910DI-25 Rochester Electronics	LOGIC (EPLD)	647
EP1810GI-45 Rochester Electronics	UV PLD, 50NS, CMOS, CPGA68	67
EP600DM-45/B Rochester Electronics	EP600DM-45/B	943
EP610DC-30 Rochester Electronics	UV PLD, 32NS, CMOS, CDIP24	185
CY7C332-15JC Rochester Electronics	OT PLD, 20NS, PAL-TYPE PQCC28	83

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA (Field-Programmable Gate Array)	High logic density, reconfigurable architecture, supports complex parallel processing	5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)	Non-volatile memory, deterministic timing, lower logic density than FPGAs	Automotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)	One-time programmable (OTP) or reprogrammable, simple logic implementation	Legacy system upgrades, low-cost IoT sensors
SoC PLD	Integrated processor cores with programmable logic	Smart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cell Count	Total number of programmable logic units	Determines implementation complexity
Maximum Operating Frequency	Up to 1 GHz in advanced FPGAs	Defines processing speed capability
Power Consumption	Measured in mW/MHz	Critical for battery-powered devices
Voltage Requirements	Typically 1.0V-3.3V	Impacts system power design
Package Type	BGA, QFN, TQFP	Affects PCB layout and thermal management
Temperature Range	-40 C to +125 C (industrial grade)	Determines operational environment suitability

5. Application Areas

Telecommunications: 5G NR signal processing, network packet switching
Automotive: ADAS sensor fusion, vehicle network gateways
Industrial: CNC machine control, industrial Ethernet protocols
Consumer: Display timing controllers, wearable device interfaces
Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx (AMD)	XCVU9P FPGA	2.5M logic cells, 58Gbps transceivers
Intel	Stratix 10 MX	1.9M logic elements, 4GB HBM2 memory
Microchip	SmartFusion2	150K logic cells, ARM Cortex-M3 processor
Lattice Semiconductor	LatticeECP5	103K LUTs, 1.5W power consumption

7. Selection Guidelines

Evaluate required logic density and I/O count
Compare power efficiency metrics (mW/GHz)
Assess toolchain capabilities (HDL support, simulation tools)
Consider temperature and reliability requirements
Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.