Embedded - PLDs (Programmable Logic Device)

Part Number	Description / PDF	Quantity
TIBPAL16R4-10CFN Texas Instruments	ELECTRICALLY ERASABLE PAL DEVICE	357
ATF16V8BQL-15XU Roving Networks / Microchip Technology	IC PLD 8MC 15NS 20TSSOP	8692
PAL16R4BCJ	OT PLD, 15NS, PAL-TYPE, TTL, CDI	897
XC2C32A-4PCG44C Xilinx	FLASH PLD, 4NS, 32-CELL PQCC44	7326
5962-8605301KA Texas Instruments	OT PLD, 30NS, PAL-TYPE	102
PAL16R6BCJ	OT PLD, 15NS, PAL-TYPE, TTL, CDI	992
ATF16V8BQL-15JC Atmel (Microchip Technology)	FLASH PLD, 15NS, PAL-TYPE, CMOS	2156
ATF22LV10CQZ-30JU Roving Networks / Microchip Technology	IC PLD 10MC 30NS 28PLCC	101
EP22V10EPC-10 Altera (Intel)	OT PLD, 10NS, PAL-TYPE	2377
TIBPAL16R6-30MJ Texas Instruments	TIBPAL16R6-30M LOW-POWER HIGH-PE	8
MDPLD22V10-15 Altera (Intel)	PLD, 15NS, PAL-TYPE	100
EPX740LC44-10Z Altera (Intel)	OT PLD, 12NS, CMOS, PQCC44	26
EP20K100FC324-3V Altera (Intel)	LOADABLE PLD, 3.6NS PBGA324	45
EP1810LC-35 Rochester Electronics	OT PLD, 40NS, CMOS, PQCC68	1924
PAL20L8BCNS	VANTIS PLD	16578
TIBPALR19R8CNT Texas Instruments	OT PLD, 25NS, PAL-TYPE	0
PAL16L8-7JC	OT PLD, 7.5NS, PAL-TYPE, TTL, PQ	11296
EPF10K100BQC208-2 Altera (Intel)	LOADABLE PLD, 12NS PQFP208	332
PAL22V10-12/B3A	OT PLD, 15NS, PAL-TYPE, TTL	180
CY7C332-20PC Rochester Electronics	OT PLD, 20NS, PAL-TYPE PDIP28	133

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA (Field-Programmable Gate Array)	High logic density, reconfigurable architecture, supports complex parallel processing	5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)	Non-volatile memory, deterministic timing, lower logic density than FPGAs	Automotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)	One-time programmable (OTP) or reprogrammable, simple logic implementation	Legacy system upgrades, low-cost IoT sensors
SoC PLD	Integrated processor cores with programmable logic	Smart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cell Count	Total number of programmable logic units	Determines implementation complexity
Maximum Operating Frequency	Up to 1 GHz in advanced FPGAs	Defines processing speed capability
Power Consumption	Measured in mW/MHz	Critical for battery-powered devices
Voltage Requirements	Typically 1.0V-3.3V	Impacts system power design
Package Type	BGA, QFN, TQFP	Affects PCB layout and thermal management
Temperature Range	-40 C to +125 C (industrial grade)	Determines operational environment suitability

5. Application Areas

Telecommunications: 5G NR signal processing, network packet switching
Automotive: ADAS sensor fusion, vehicle network gateways
Industrial: CNC machine control, industrial Ethernet protocols
Consumer: Display timing controllers, wearable device interfaces
Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx (AMD)	XCVU9P FPGA	2.5M logic cells, 58Gbps transceivers
Intel	Stratix 10 MX	1.9M logic elements, 4GB HBM2 memory
Microchip	SmartFusion2	150K logic cells, ARM Cortex-M3 processor
Lattice Semiconductor	LatticeECP5	103K LUTs, 1.5W power consumption

7. Selection Guidelines

Evaluate required logic density and I/O count
Compare power efficiency metrics (mW/GHz)
Assess toolchain capabilities (HDL support, simulation tools)
Consider temperature and reliability requirements
Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.