Embedded - PLDs (Programmable Logic Device)

Part Number	Description / PDF	Quantity
PAL20R4A2CNS	VANTIS PLD	136
EP20K100TC144-2 Altera (Intel)	LOADABLE PLD, 3NS, CMOS, PQFP144	77
ATF22V10B-15GM/883 Roving Networks / Microchip Technology	IC PLD 10MC 15NS 24CDIP	0
EP224PC-7 Altera (Intel)	OT PLD, 7.5NS, PAL-TYPE	10531
TIBPAL22V10-7CNT Texas Instruments	OT PROGRAMMABLE LOGIC DEVICES	2183
ATF22V10CQZ-20SI Atmel (Microchip Technology)	EE PLD, 20NS, PAL-TYPE, CMOS	1276
JM38510/50503BLA Texas Instruments	OT PLD, 25NS, TTL	0
ATF22LV10CQZ-30JC Atmel (Microchip Technology)	FLASH PLD, 30NS, PAL-TYPE, CMOS	878
PAL20R8ACNS	OT PLD, 25NS, PAL-TYPE, TTL, PDI	5619
TIBPAL20R4-20MJTB Texas Instruments	TIBPAL20R4-20M HIGH-PERFORMANCE	142
ATF22V10C-10XU Roving Networks / Microchip Technology	IC PLD 10MC 10NS 24TSSOP	441
PAL20R6ACNL	OT PLD, 25NS, PAL-TYPE, TTL, PQC	1233
XC95144XV-7CS144C Xilinx	FLASH PLD, 7.5NS, 144-CELL	1459
TIBPAL20X10-20CFN Texas Instruments	OT PLD, 20NS, PAL-TYPE, TTL,	538
XC95288XV-10FG256I Xilinx	FLASH PLD, 10NS, 288-CELL	525
JM38510/50603BRA Texas Instruments	OT PLD, 20NS, TTL, CDIP20	210
PAL20R8A-2ML/883B	OT PLD, 25NS, PAL-TYPE, TTL	630
ATF16V8CZ-15PI Atmel (Microchip Technology)	FLASH PLD, 15NS, PAL-TYPE, CMOS	605
MACH211-20JC	VANTIS EE PLD 20NS 64-CELL	5397
EP20K400BC652-2V Altera (Intel)	LOADABLE PLD, 3.1NS PBGA652	6

Embedded - PLDs (Programmable Logic Device)

1. Overview

Programmable Logic Devices (PLDs) are semiconductor devices that can be configured by users to perform specific logic functions. Unlike fixed-function logic devices, PLDs offer reprogrammable capabilities, enabling dynamic adaptation to changing design requirements. In embedded systems, PLDs serve as critical components for implementing custom logic, interface bridging, and real-time processing. Their flexibility supports rapid prototyping and reduces time-to-market in applications ranging from consumer electronics to aerospace systems.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
FPGA (Field-Programmable Gate Array)	High logic density, reconfigurable architecture, supports complex parallel processing	5G base stations, AI accelerators, medical imaging systems
CPLD (Complex PLD)	Non-volatile memory, deterministic timing, lower logic density than FPGAs	Automotive ECUs, industrial motor controllers
PAL/GAL (Programmable Array Logic/General Array Logic)	One-time programmable (OTP) or reprogrammable, simple logic implementation	Legacy system upgrades, low-cost IoT sensors
SoC PLD	Integrated processor cores with programmable logic	Smart cameras, edge computing devices

3. Structure and Composition

PLDs typically consist of three core elements: (1) Configurable Logic Blocks (CLBs) containing lookup tables (LUTs) and flip-flops for implementing Boolean functions; (2) Programmable interconnect resources enabling flexible signal routing; (3) Input/Output Blocks (IOBs) providing interface compatibility with external circuits. Advanced devices may integrate DSP slices, memory blocks, or hard processor cores. Physical packaging ranges from QFP (Quad Flat Package) for low-pin-count devices to high-density BGA (Ball Grid Array) packages for FPGAs.

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cell Count	Total number of programmable logic units	Determines implementation complexity
Maximum Operating Frequency	Up to 1 GHz in advanced FPGAs	Defines processing speed capability
Power Consumption	Measured in mW/MHz	Critical for battery-powered devices
Voltage Requirements	Typically 1.0V-3.3V	Impacts system power design
Package Type	BGA, QFN, TQFP	Affects PCB layout and thermal management
Temperature Range	-40 C to +125 C (industrial grade)	Determines operational environment suitability

5. Application Areas

Telecommunications: 5G NR signal processing, network packet switching
Automotive: ADAS sensor fusion, vehicle network gateways
Industrial: CNC machine control, industrial Ethernet protocols
Consumer: Display timing controllers, wearable device interfaces
Aerospace: Flight control systems, radiation-hardened avionics

6. Leading Manufacturers and Products

Manufacturer	Representative Product	Key Specifications
Xilinx (AMD)	XCVU9P FPGA	2.5M logic cells, 58Gbps transceivers
Intel	Stratix 10 MX	1.9M logic elements, 4GB HBM2 memory
Microchip	SmartFusion2	150K logic cells, ARM Cortex-M3 processor
Lattice Semiconductor	LatticeECP5	103K LUTs, 1.5W power consumption

7. Selection Guidelines

Evaluate required logic density and I/O count
Compare power efficiency metrics (mW/GHz)
Assess toolchain capabilities (HDL support, simulation tools)
Consider temperature and reliability requirements
Verify long-term supply stability for mass production

Industry Trend Analysis

The PLD market is evolving toward heterogeneous integration, combining FPGA fabric with AI acceleration engines and high-bandwidth memory. Emerging trends include: (1) 3D IC stacking for improved performance/watt ratios; (2) RISC-V processor integration in FPGA SoCs; (3) AI-optimized compute-in-memory architectures; (4) Enhanced security features like hardware-based root of trust. The global PLD market is projected to grow at 9.2% CAGR through 2027, driven by demand in automotive ADAS and 5G infrastructure.