Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MC68SEC000AE20

MC68SEC000AE20

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, MC68000

252

MPC8536EAVTANGA

MPC8536EAVTANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 800MHZ, PBGA783

1165

MPC875ZT66

MPC875ZT66

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

791

MC9328MXLDVM15R2

MC9328MXLDVM15R2

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX21 - MULTIMEDIA APPLICATIONS

0

MPC8315VRAFDA

MPC8315VRAFDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC II PRO PROCESSOR

612

MPC8377EVRALG

MPC8377EVRALG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 667MHZ, PBGA689

3

MPC8349EVVAJFB

MPC8349EVVAJFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

48

MPC8569CVTAQLJB

MPC8569CVTAQLJB

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 1067MHZ, CMOS, PBGA783

31

P1012NSE2FFB

P1012NSE2FFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ INTEGRATED PROCESSOR

21

MPC8548EVTAQGD

MPC8548EVTAQGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

76

MPC860PCVR66D4

MPC860PCVR66D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

60

MPC8313EVRADDB

MPC8313EVRADDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 400MHZ, CMOS, PBGA516

4880

P1011NSE2DFB557

P1011NSE2DFB557

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR 32 BI

0

MC68LC060RC50

MC68LC060RC50

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 50MHZ, CPGA206

1130

MC68HC000IEI16R

MC68HC000IEI16R

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 16.67MHZ, CMOS, PQCC68

1657

MPC852TVR80A

MPC852TVR80A

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

1320

MPC8270ZUQLDA

MPC8270ZUQLDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

321

MPC8545EHXAQG

MPC8545EHXAQG

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, CBGA783

1

MPC8548PXAUJC

MPC8548PXAUJC

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC III INTEGRATED PROCES

636

MPC8535EAVTATH

MPC8535EAVTATH

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1250MHZ, PBGA783

30

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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