Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC857TZQ100B

MPC857TZQ100B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

132

MC68HC000RC8

MC68HC000RC8

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 8MHZ, CMOS, CPGA68

772

MPC8321EVRADDC

MPC8321EVRADDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 266MHZ, CMOS, PBGA516

289

MPC8347VRADDB

MPC8347VRADDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

104

MC9SDJ128BCFUR2

MC9SDJ128BCFUR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, 25MHZ PQFP80

564

MC68LC302AF16VCT

MC68LC302AF16VCT

Freescale Semiconductor, Inc. (NXP Semiconductors)

INTEGRATED MULTIPROTOCOL MICROPR

1215

P5010NSN7VNB

P5010NSN7VNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

3

MPC8544EVTALF

MPC8544EVTALF

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 667MHZ, PBGA783

379

MC9S12XDT512MPV

MC9S12XDT512MPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 40MHZ

420

MPC5200BV400

MPC5200BV400

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

200

MPC8548VTAQGB

MPC8548VTAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

117

MPC853TVR100A-FR

MPC853TVR100A-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

91

MPC8540VT667LC

MPC8540VT667LC

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

70

MC68302RC20C

MC68302RC20C

Freescale Semiconductor, Inc. (NXP Semiconductors)

LAN CONTROLLER, CMOS, CPGA132

68

MPC8533VTARJA

MPC8533VTARJA

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

2450

MPC8548VTAVHB

MPC8548VTAVHB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1500MHZ, PBGA783

911

MC9S12E64MPV

MC9S12E64MPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 25MHZ

1171

MPC8536ECVTAVLA

MPC8536ECVTAVLA

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1500MHZ, PBGA783

43

P1025NSE5DFB

P1025NSE5DFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 2

128

MC8641VU1333JE

MC8641VU1333JE

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 166.66MHZ, CBGA1023

570

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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