Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MCIMX6Q4AVT10AC

MCIMX6Q4AVT10AC

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, QUAD A

4

MPC870VR133

MPC870VR133

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

4

MPC8321CZQADDC

MPC8321CZQADDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 266MHZ, CMOS, PBGA516

114

MCIMX507CVM1BR2

MCIMX507CVM1BR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

MULTIFUNCTION PERIPHERAL, CMOS,

30000

MPC860SRZQ50D4

MPC860SRZQ50D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

191

MPC857DSLCVR66B

MPC857DSLCVR66B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

41

MPC8321VRADDC

MPC8321VRADDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 266MHZ, CMOS, PBGA516

15

MCIMX6G3DVK05AA

MCIMX6G3DVK05AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 32 BIT MPU, ARM CORTEX-A7 C

520

MPC8358VVADDEA

MPC8358VVADDEA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

21

KMC7448THX1400ND

KMC7448THX1400ND

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

0

MCIMX253CJM4

MCIMX253CJM4

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, CMOS, PBGA400

133

MC68EC020AA25R

MC68EC020AA25R

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MPU, 32-BIT, 25MHZ

13479

MPC8309VMAHFCA

MPC8309VMAHFCA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC POWER ARCH SOC, 417MH

0

MPC8533VJALFA

MPC8533VJALFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

53

MCIMX6D6AVT10AC

MCIMX6D6AVT10AC

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, DUAL A

15

P1010NXN5DFA

P1010NXN5DFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

66

MPC8555EPXAPF

MPC8555EPXAPF

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 833MHZ, CMOS, PBGA783

234

MC68EC000CAA20

MC68EC000CAA20

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MPU, 32-BIT, 20MHZ

0

MPC8255ACVVMHBB

MPC8255ACVVMHBB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

161

MCIMX6L7DVN10AA

MCIMX6L7DVN10AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, CMOS

928

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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