Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MC7447AHX600NB

MC7447AHX600NB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

19

P3041NSE1NNB

P3041NSE1NNB

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 1333MHZ, CMOS, PBGA1295

0

MCIMX6D4AVT10ACR

MCIMX6D4AVT10ACR

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32-BIT MPU, DUAL A

1500

MCIMX6G2DVM05AA

MCIMX6G2DVM05AA

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 32 BIT MPU, ARM CORTEX-A7 C

0

MPC8349CZUAJDB

MPC8349CZUAJDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32-BIT, 533MHZ,

44

MPC8545VTAQGB

MPC8545VTAQGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

386

MPC8347EVRAGDB

MPC8347EVRAGDB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

0

MC9S12XD256VPV

MC9S12XD256VPV

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, CPU12 CPU, 40MHZ

360

P2010NSE2MFC

P2010NSE2MFC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 12

133

MPC862TVR80B

MPC862TVR80B

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

91

P1014NSE5HFA

P1014NSE5HFA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MICROPROCESSOR, POWER

763

MCIMX6S4AVM08AB

MCIMX6S4AVM08AB

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 6 SERIES 32 BIT MPU, ARM CO

0

MPC8541VTAJD

MPC8541VTAJD

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

306

MPC8555PXAPF

MPC8555PXAPF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

280

MC68360CAI25L

MC68360CAI25L

Freescale Semiconductor, Inc. (NXP Semiconductors)

QUICC COMMUNICATIONS CONTROLLER,

0

KMPC8543EVUAQG

KMPC8543EVUAQG

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC III MICROPROCESSOR (M

0

MPC8321EVRAFDC

MPC8321EVRAFDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 333MHZ, CMOS, PBGA516

672

MC9S08RG32CFJ

MC9S08RG32CFJ

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 8MHZ PQFP32

0

MPC8541PXAPF

MPC8541PXAPF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

3143

P2020NSN2HHC

P2020NSN2HHC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 32-BIT POWER ARCH SOC, 2

2

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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