Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8555EPXALF

MPC8555EPXALF

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

577

MPC8260ACZUMHBB

MPC8260ACZUMHBB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

218

MC68HC11E0CFN2R2

MC68HC11E0CFN2R2

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, MROM, 2MHZ, HCMOS,

2038

MC9S08RC16CFJ

MC9S08RC16CFJ

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, FLASH, 8MHZ PQFP32

7745

MPC8377EVRANGA

MPC8377EVRANGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

1

MPC8548ECPXAUJB

MPC8548ECPXAUJB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1333MHZ, PBGA783

1

MC68EN360VR25L

MC68EN360VR25L

Freescale Semiconductor, Inc. (NXP Semiconductors)

QUICC COMMUNICATIONS CONTROLLER,

2373

P5040NSE72QC

P5040NSE72QC

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, 64-BIT POWER ARCH SOC, 4

28

MC68HC000CEI12

MC68HC000CEI12

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 12.5MHZ, CMOS, PQCC68

1055

MCF54410CMF250

MCF54410CMF250

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, COLDFIRE

3213

MC7447AHX867NB

MC7447AHX867NB

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT, POW

1792

MPC8572ECLPXATLE

MPC8572ECLPXATLE

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR

4

MPC8241TZQ166D

MPC8241TZQ166D

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32 BIT,MPC6

0

MCIMX6G2CVK05AA-FR

MCIMX6G2CVK05AA-FR

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX 32 BIT MPU, ARM CORTEX-A7 C

130

MC7448VU1000LD

MC7448VU1000LD

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, 32-BIT, POW

14

MPC885ZP66

MPC885ZP66

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

1887

P1010NSE5HHA

P1010NSE5HHA

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ RISC MPU 32-BIT ,

105

MPC8321CZQAFDC

MPC8321CZQAFDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 333MHZ, CMOS, PBGA516

160

MC68LC040RC25A

MC68LC040RC25A

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, MC68000

0

MC68360AI33L

MC68360AI33L

Freescale Semiconductor, Inc. (NXP Semiconductors)

QUICC COMMUNICATIONS CONTROLLER,

43

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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