Embedded - Microprocessors

Image Part Number Description / PDF Quantity Rfq
MPC8321ZQADDC

MPC8321ZQADDC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 266MHZ, CMOS, PBGA516

2305

MC68EC060RC66

MC68EC060RC66

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 66MHZ, CPGA206

67

MPC603RRX266LC

MPC603RRX266LC

Freescale Semiconductor, Inc. (NXP Semiconductors)

32-BIT, 266MHZ, CMOS, CBGA255

50

P1020NSE2FFB

P1020NSE2FFB

Freescale Semiconductor, Inc. (NXP Semiconductors)

QORIQ, POWER ARCH 32-BIT SOC, 2

10

MPC8560PXAQFC

MPC8560PXAQFC

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC III INTEGRATED PROCES

130

MPC8548VTAQGD

MPC8548VTAQGD

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 1000MHZ, PBGA783

523

MPC860SRVR66D4

MPC860SRVR66D4

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

42

MCIMX357CVM5B

MCIMX357CVM5B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX35 32-BIT MPU, ARM1136JF-S C

925

MPC8543EVTANGB

MPC8543EVTANGB

Freescale Semiconductor, Inc. (NXP Semiconductors)

MPU, 32-BIT, 800MHZ, PBGA783

76

MPC8358ECVRAGDDA

MPC8358ECVRAGDDA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCH SOC

26

MPC875CZT66

MPC875CZT66

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

44

MC68EC000E116

MC68EC000E116

Freescale Semiconductor, Inc. (NXP Semiconductors)

MICROPROCESSOR, 32 BIT, MC68000

27

MCIMX31CJMN4C

MCIMX31CJMN4C

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX31 32-BIT MPU, ARM1136JF-S C

0

MPC8569EVJAUNLB

MPC8569EVJAUNLB

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC 32 BIT POWER ARCHITEC

88

MC9328MXLVP15

MC9328MXLVP15

Freescale Semiconductor, Inc. (NXP Semiconductors)

RISC MICROPROCESSOR, DRAGONBALL,

80

MPC8358ECZQAGDGA

MPC8358ECZQAGDGA

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSOR,

33

MC9SDG256BCFUR2

MC9SDG256BCFUR2

Freescale Semiconductor, Inc. (NXP Semiconductors)

16-BIT, FLASH, 25MHZ PQFP80

3000

MC68HSC705J1ACP

MC68HSC705J1ACP

Freescale Semiconductor, Inc. (NXP Semiconductors)

8-BIT, OTPROM, 6805 CPU, 4MHZ

3046

MCIMX355AVM4B

MCIMX355AVM4B

Freescale Semiconductor, Inc. (NXP Semiconductors)

I.MX35 32-BIT MPU, ARM1136JF-S C

90

MPC8541EPXAJD

MPC8541EPXAJD

Freescale Semiconductor, Inc. (NXP Semiconductors)

POWERQUICC RISC MICROPROCESSORS,

684

Embedded - Microprocessors

1. Overview

Embedded microprocessors are specialized computing units designed for dedicated control, monitoring, or processing tasks within electronic systems. Unlike general-purpose CPUs, they integrate processing cores, memory interfaces, and peripheral controllers into a single chip (SoC) to optimize performance, power efficiency, and cost for specific applications. These devices form the backbone of modern IoT, automotive systems, industrial automation, and consumer electronics.

2. Main Types and Functional Classification

TypeFunctional CharacteristicsApplication Examples
ARM Cortex-M SeriesLow-power 32-bit cores with real-time capabilities, optional DSP extensionsSmart sensors, wearables, motor control
PowerPCHigh reliability, floating-point units, automotive/Aerospace focusedVehicle ECUs, avionics systems
MIPSEfficient pipelining, 32/64-bit variants for multimedia processingNetworking equipment, set-top boxes
RISC-VOpen instruction set, modular architecture for customizationAI accelerators, edge computing devices
x86 (Embedded)PC compatibility, high processing power with integrated GPUsIndustrial PCs, medical imaging equipment

3. Architecture and Components

A typical embedded microprocessor contains:

  • Processing Core(s): RISC/Complex Instruction Set architectures with 1-8 cores
  • Memory Subsystem: Integrated SRAM, ROM, and external DRAM controllers
  • Peripheral Interfaces: UART, SPI, I2C, USB, CAN, PCIe, Ethernet MAC
  • Real-Time Components: Watchdog timers, PWM generators, ADC/DAC modules
  • Power Management: Multiple sleep modes, DVFS (Dynamic Voltage/Frequency Scaling)

4. Key Technical Specifications

ParameterDescriptionImportance
Clock FrequencyOperating speed (10MHz-6GHz)Determines processing throughput
Instruction SetRISC vs CISC architectureAffects code density and power consumption
TDP (Thermal Design Power)Power consumption under load (100mW-50W)Dictates thermal management requirements
Process NodeManufacturing technology (28nm-5nm)Impacts performance and energy efficiency
Memory BandwidthData transfer rate between core and memoryLimits performance in data-intensive tasks

5. Application Domains

  • Consumer Electronics: Smartphones (application processors), home appliances
  • Automotive: ADAS controllers, engine management systems
  • Industrial: PLCs (Programmable Logic Controllers), robotics
  • Healthcare: MRI scanners, portable diagnostic devices
  • Communications: 5G base stations, optical network transceivers

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
ARM HoldingsCortex-A78128-bit NEON engine, 4nm process, 3.0GHz
IntelAtom x6425EQuad-core, 12W TDP, integrated Intel HD Graphics
NXP Semiconductorsi.MX 8M Plus1.8GHz Cortex-A53, NPU for ML acceleration
MicrochipSAM9X6032-bit ARM926EJ-S, 120MHz, ECC memory support
QualcommQCS610Hexagon DSP, Adreno GPU, AI Engine for computer vision

7. Selection Guidelines

Key considerations include:

  • Performance requirements vs power budget (e.g., Cortex-M55 for ultra-low-power AI)
  • Real-time constraints (deterministic latency for motor control applications)
  • Peripheral integration (CAN FD for automotive networks)
  • Software ecosystem (RTOS support, middleware availability)
  • Longevity and supply chain stability (automotive-grade qualification)

Case Study: A smart thermostat design selected NXP's MCIMX7U5 (Cortex-M4 + Cortex-A7) for its combination of real-time sensor processing and application-layer connectivity.

8. Industry Trends

Emerging directions include:

  • AI integration: On-chip neural processing units (NPUs) for edge ML inference
  • Heterogeneous computing: Multi-architecture SoCs (RISC-V + GPU + NPU)
  • Advanced packaging: 3D-stacked memory integration for bandwidth-intensive applications
  • Functional safety: ISO 26262 compliance for autonomous vehicle systems
  • Open ecosystems: Growth of RISC-V adoption in custom ASIC designs
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