Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
S1C17702F101100

S1C17702F101100

Epson

IC MCU 16BIT 128KB FLASH 176LQFP

0

S1C17564D111000

S1C17564D111000

Epson

IC MCU 16BIT 128KB FLASH 64TQFP

0

S1C17704B403100

S1C17704B403100

Epson

IC MCU 16BIT 64KB FLASH 144VFBGA

0

S1C17W13F001100-160

S1C17W13F001100-160

Epson

16-BIT MCU 4.2MHZ 48KB FLASH 2KB

0

S1C17M10F101100

S1C17M10F101100

Epson

IC MCU 16BIT 16KB FLSH 128TQFP15

0

S1C17W15F004100

S1C17W15F004100

Epson

IC MCU 16BIT 64KB FLASH 100QFP

0

S1C17M13F101100-250

S1C17M13F101100-250

Epson

IC MCU 16BIT 16KB FLASH 48TQFP12

0

S1C17704B102100

S1C17704B102100

Epson

IC MCU 16BIT 64KB FLASH 161VFBGA

0

S1C17W15D001000

S1C17W15D001000

Epson

IC MCU 16BIT 64KB FLASH DIE

0

S1C17W36F001100-40

S1C17W36F001100-40

Epson

16-BIT MCU 4.2MHZ 384KB FLASH 16

0

S1C17704B402100

S1C17704B402100

Epson

IC MCU 16BIT 64KB FLASH 161VFBGA

0

S1C17W22F101100-90

S1C17W22F101100-90

Epson

16-BIT MCU 4.2MHZ 64KB FLASH 4KB

0

S1C17W23F101100-90

S1C17W23F101100-90

Epson

16-BIT MCU 4.2MHZ 96KB FLASH 8KB

0

S1C17W15F005100

S1C17W15F005100

Epson

IC MCU 16BIT 64KB FLASH DIE

0

S1C17W16F102100

S1C17W16F102100

Epson

16-BIT MCU 4.2MHZ 64KB FLASH 8KB

0

S1C17704F401100

S1C17704F401100

Epson

IC MCU 16BIT 64KB FLASH 144TQFP

0

S1C17704B103100

S1C17704B103100

Epson

IC MCU 16BIT 64KB FLASH 144VFBGA

0

S1C17W34F001100

S1C17W34F001100

Epson

16-BIT MCU 4.2MHZ 128KB FLASH 12

0

S1C17W35F001100

S1C17W35F001100

Epson

16-BIT MCU 4.2MHZ 256KB FLASH 12

0

S1C17W35F001100-40

S1C17W35F001100-40

Epson

16-BIT MCU 4.2MHZ 256KB FLASH 12

0

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
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