Embedded - Microcontrollers

Image Part Number Description / PDF Quantity Rfq
S1C17W04F101100-250

S1C17W04F101100-250

Epson

IC MCU 16BIT 16KB FLASH 48TQFP

0

S1C31W74B201000

S1C31W74B201000

Epson

IC MCU 32BIT 512KB FLSH 181VFBGA

1039

S1C17W04F102100

S1C17W04F102100

Epson

IC MCU 16BIT 32KB FLASH 48TQFP

0

S1C17W15F003100

S1C17W15F003100

Epson

IC MCU 16BIT 64KB FLASH 64TQFP

0

S1C17W04F102100-490

S1C17W04F102100-490

Epson

IC MCU 16BIT 32KB FLASH 48TQFP

0

S1C17W15F002100

S1C17W15F002100

Epson

IC MCU 16BIT 64KB FLASH 100QFP

0

S1C17W18F102100

S1C17W18F102100

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

0

S1C17M12F101100

S1C17M12F101100

Epson

IC MCU 16BIT 16KB FLASH 48TQFP

0

S1C17W03F102100-490

S1C17W03F102100-490

Epson

IC MCU 16BIT 16KB FLASH 48TQFP

0

S1C17W03F101100

S1C17W03F101100

Epson

IC MCU 16BIT 32KB FLASH 48TQFP

997

S1C17W23F101100

S1C17W23F101100

Epson

IC MCU 16BIT 96KB FLASH 128TQFP

53

S1C17W03F101100-250

S1C17W03F101100-250

Epson

IC MCU 16BIT 16KB FLASH 48TQFP

0

S1C17W18F101100

S1C17W18F101100

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

892

S1C17W04F101100

S1C17W04F101100

Epson

IC MCU 16BIT 16KB FLASH 48TQFP

1222

S1C17W18F101100-90

S1C17W18F101100-90

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

0

S1C17W22F101100

S1C17W22F101100

Epson

IC MCU 16BIT 64KB FLASH 128TQFP

895

S1C17W18F103100-119

S1C17W18F103100-119

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

0

S1C17W18F102100-260

S1C17W18F102100-260

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

0

S1C17W03F102100

S1C17W03F102100

Epson

IC MCU 16BIT 32KB FLASH 48TQFP

0

S1C17W18F103100

S1C17W18F103100

Epson

IC MCU 16BIT 96KB FLASH 80TQFP

0

Embedded - Microcontrollers

1. Overview

Embedded microcontrollers (MCUs) are compact integrated circuits designed to control specific functions in embedded systems. They combine processing cores, memory, and peripheral interfaces into a single chip, enabling efficient control in applications ranging from consumer electronics to industrial automation. Their importance lies in enabling smart, connected, and autonomous systems in modern technology ecosystems.

2. Main Types and Functional Classification

Type Functional Characteristics Application Examples
General-Purpose MCUs Balanced performance, basic peripherals (timers, UART) Home appliances, simple sensors
Low-Power MCUs Optimized for energy efficiency, sleep modes Wearable devices, IoT edge nodes
High-Performance MCUs 32/64-bit cores, DSP capabilities, high-speed interfaces Industrial automation, automotive systems
Automotive MCUs ISO 26262 certified, extended temperature range Engine control units, ADAS

3. Structure and Components

Typical microcontroller architecture includes:

  • CPU core (e.g., ARM Cortex-M, RISC-V)
  • Memory (Flash, SRAM, EEPROM)
  • Peripherals (GPIO, SPI, I2C, ADC/DAC)
  • Real-time clock (RTC)
  • Power management unit
  • Communication interfaces (CAN, Ethernet, USB)

Physical packaging ranges from 8-pin DIP to 200+ pin BGA for complex applications.

4. Key Technical Specifications

Parameter Description
Clock Speed Determines processing capability (1 MHz - 1 GHz)
Memory Size Flash (code storage) and RAM (data processing)
Power Consumption Active/current sleep mode current draw
I/O Lines Number and type of programmable GPIO
Operating Temperature Industrial (-40 C to 85 C) or automotive (-40 C to 125 C)

5. Application Areas

  • Consumer Electronics: Smart home devices, wearables
  • Industrial: Motor control, factory automation
  • Automotive: Body control modules, EV battery management
  • Medical: Portable diagnostic equipment, infusion pumps
  • IoT: Wireless sensor networks, edge AI nodes

6. Leading Manufacturers and Products

Manufacturer Headquarters Representative Products
Texas Instruments USA MSP430FR5994 (low-power sensing)
STMicroelectronics Switzerland STM32H7 (high-performance)
Microchip Technology USA PIC32MZ (32-bit general purpose)
NXP Semiconductors Netherlands Kinetis K82 (automotive-grade)
Infineon Technologies Germany Traveo S6J3 (automotive graphics)

7. Selection Recommendations

Key considerations:

  1. Match core architecture to computational needs
  2. Verify peripheral compatibility with sensors/actuators
  3. Check temperature/ruggedness ratings
  4. Evaluate software ecosystem (RTOS support, middleware)
  5. Consider long-term supply stability

Example: For a battery-powered IoT sensor node, prioritize ultra-low power MCUs like the EFR32MG21 with integrated wireless capabilities.

8. Industry Trends

  • Integration of AI acceleration (e.g., Arm Ethos-U NPU)
  • Edge computing focus with on-chip machine learning
  • Enhanced security features (TrustZone, secure boot)
  • Sub-1V operation for energy harvesting applications
  • Growth of heterogeneous multi-core MCUs
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