Embedded - FPGAs (Field Programmable Gate Array)

Part Number	Description / PDF	Quantity
EP1S20F672C6 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 2	64
EP1K100FC256-1 Flip Electronics	LOADABLE PLD, 0.4NS, CMOS, PBGA2	0
XC2S50E-6FTG256I Flip Electronics	SPARTAN-IIE FIELD PROGRAMMABLE G	511
A54SX32A-TQ100I Flip Electronics	IC FPGA 81 I/O 100TQFP	0
LFXP10C-5F256C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
EP1K30QI208-2N Flip Electronics	LOADABLE PLD, 0.4NS, CMOS, PQFP2	0
EPF81500AQC240-4 Flip Electronics	LOADABLE PLD, 1.9NS, CMOS, PQFP2	65
EP1S30F1020C6 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 3	2927
EPF10K130EQC240-2N Flip Electronics	LOADABLE PLD, 0.5NS, CMOS, PQFP2	0
EPF10K50VBI356-3N Flip Electronics	LOADABLE PLD, 0.5NS, CMOS, PBGA3	0
LFXP3C-5TN100C Flip Electronics	FPGA - FIELD PROGRAMMABLE GATE A	0
EP4SGX70HF35C4N Flip Electronics	STRATIX IV FPGA, 29040 CLBS, 717	88
EP1S20F484C5N Flip Electronics	STRATIX DEVICE FAMILY, FIELD PRO	0
A42MX16-PL84I Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
LFXP10C-5FN256C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
A3P250-PQ208 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 6	0
XC2S50E-6FTG256C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 3	0
EPF10K10TC144-3 Flip Electronics	EMBEDDED PROGRAMMABLE LOGIC DEVI	131
LFXP15C-5F484C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
EPF10K50EFI256-2 Flip Electronics	EMBEDDED PROGRAMMABLE LOGIC DEVI	158

Embedded - FPGAs (Field Programmable Gate Array)

1. Overview

Field Programmable Gate Arrays (FPGAs) are reconfigurable semiconductor devices containing programmable logic blocks and interconnects. They enable hardware-level customization for specific computational tasks, offering flexibility unmatched by ASICs or microprocessors. In modern technology, FPGAs are critical for applications requiring parallel processing, low-latency execution, and real-time adaptability, such as AI acceleration, 5G communications, and industrial automation.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Low-Cost FPGAs	Optimized for budget-sensitive applications with minimal logic density	Consumer electronics, IoT edge devices
High-Performance FPGAs	Advanced DSP blocks, high-speed transceivers (>100 Gbps)	Data centers, radar systems
SoC FPGAs	Integrated ARM processors with FPGA fabric	Industrial control, medical imaging
MPSoC FPGAs	Multi-core processors with AI acceleration engines	Autonomous vehicles, 5G base stations

3. Architecture and Components

A typical FPGA consists of:

Logic Units: Configurable Lookup Tables (LUTs) and flip-flops for implementing Boolean functions
Routing Resources: Programmable interconnects for signal pathways
I/O Interfaces: Standardized protocols (PCIe, DDR4, Ethernet)
Embedded Memory: Block RAM and distributed RAM for data storage
Clock Management: Phase-Locked Loops (PLLs) for precise timing control
DSP Blocks: Hardened multipliers and accumulators for signal processing

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cells	Number of configurable logic units (10K 2M+)	Determines computational complexity
Max Frequency	Operating speed (100 MHz 1 GHz)	Impacts processing throughput
Power Consumption	Thermal Design Power (TDP: 1W 100W)	Critical for battery-powered systems
Package Type	BGA, Flip-Chip, System-in-Package (SiP)	Affects PCB integration
Memory Bandwidth	Data transfer rate (10 GB/s 1 TB/s)	Essential for AI/data-intensive tasks

5. Application Domains

Telecommunications: 5G NR base stations, optical network switches
Industrial: Motor control, machine vision systems
Automotive: ADAS sensor fusion, LiDAR processing
Healthcare: MRI image reconstruction, ultrasound beamforming
Aerospace: Satellite communication modems, flight control systems

6. Leading Manufacturers and Products

Vendor	Representative Product	Key Features
Xilinx	Zynq UltraScale+ MPSoC	Quad-core ARM Cortex-A53 + 1.6M logic cells
Intel	Stratix 10 GX	10M logic elements, 14 Gbps transceivers
Lattice	MachXO3D	Low-power <100K LUTs with security features
Microchip	PolarFire SoC	256-bit RISC-V processor, 4.9M logic cells

7. Selection Guidelines

Key considerations:

Evaluate required logic density and I/O bandwidth
Balance performance vs. power budget (e.g., automotive vs. data center)
Assess toolchain support (Vivado, Quartus, etc.)
Consider long-term availability for industrial/medical systems
Verify protocol compatibility (e.g., PCIe Gen5, DDR5)

8. Industry Trends

Future directions include:

AI-optimized FPGAs with integrated tensor cores
3D-stacked memory integration for >1 TB/s bandwidth
Open-source toolchain adoption (e.g., GHDL, Yosys)
Heterogeneous computing with hybrid CPU-GPU-FPGA architectures
Advanced node processes (5nm/3nm) enabling 10M+ logic cells