Embedded - FPGAs (Field Programmable Gate Array)

Part Number	Description / PDF	Quantity
EP1S20F672C6N Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 2	107
LFEC3E-4FN256C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 3	0
LFXP3C-5T144C Flip Electronics	IC FPGA 100 I/O 144TQFP	0
EP1S60F1020C7 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 6	382
LFEC15E-5FN256C Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
A40MX04-PL84 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 5	0
EPF81188AQC240-2 Flip Electronics	FPGA - FLEX 8000 126 LABS 184 IO	619
EPF10K100EQC240-1 Flip Electronics	LOADABLE PLD, 0.4NS, CMOS, PQFP2	241
APA450-PQ208I Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 4	0
EP1S40F780C8 Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 4	227
EP1S20B672C6N Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 2	130
EP1S10F780C7N Flip Electronics	STRATIX DEVICE FAMILY, FIELD PRO	180
EP1S25F1020C6N Flip Electronics	STRATIX DEVICE FAMILY FIELD PROG	3501
EP1K30FC256-3N Flip Electronics	LOADABLE PLD, 0.6NS, CMOS, PBGA2	0
LFXP10C-3F256I Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 1	0
EPF6016ATC144-1N Flip Electronics	LOADABLE PLD, CMOS, PQFP144	0
LCMXO2280E-4M132I Flip Electronics	FLASH PLD, 4.4NS, CMOS, PBGA132	0
EP20K100EFC324-3N Flip Electronics	LOADABLE PLD, 2.2NS, CMOS, PBGA3	542
EPF10K10QI208-4 Flip Electronics	LOADABLE PLD, 0.6NS, CMOS, PQFP2	0
EP4SGX70HF35C3N Flip Electronics	FIELD PROGRAMMABLE GATE ARRAY, 2	558

Embedded - FPGAs (Field Programmable Gate Array)

1. Overview

Field Programmable Gate Arrays (FPGAs) are reconfigurable semiconductor devices containing programmable logic blocks and interconnects. They enable hardware-level customization for specific computational tasks, offering flexibility unmatched by ASICs or microprocessors. In modern technology, FPGAs are critical for applications requiring parallel processing, low-latency execution, and real-time adaptability, such as AI acceleration, 5G communications, and industrial automation.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
Low-Cost FPGAs	Optimized for budget-sensitive applications with minimal logic density	Consumer electronics, IoT edge devices
High-Performance FPGAs	Advanced DSP blocks, high-speed transceivers (>100 Gbps)	Data centers, radar systems
SoC FPGAs	Integrated ARM processors with FPGA fabric	Industrial control, medical imaging
MPSoC FPGAs	Multi-core processors with AI acceleration engines	Autonomous vehicles, 5G base stations

3. Architecture and Components

A typical FPGA consists of:

Logic Units: Configurable Lookup Tables (LUTs) and flip-flops for implementing Boolean functions
Routing Resources: Programmable interconnects for signal pathways
I/O Interfaces: Standardized protocols (PCIe, DDR4, Ethernet)
Embedded Memory: Block RAM and distributed RAM for data storage
Clock Management: Phase-Locked Loops (PLLs) for precise timing control
DSP Blocks: Hardened multipliers and accumulators for signal processing

4. Key Technical Specifications

Parameter	Description	Importance
Logic Cells	Number of configurable logic units (10K 2M+)	Determines computational complexity
Max Frequency	Operating speed (100 MHz 1 GHz)	Impacts processing throughput
Power Consumption	Thermal Design Power (TDP: 1W 100W)	Critical for battery-powered systems
Package Type	BGA, Flip-Chip, System-in-Package (SiP)	Affects PCB integration
Memory Bandwidth	Data transfer rate (10 GB/s 1 TB/s)	Essential for AI/data-intensive tasks

5. Application Domains

Telecommunications: 5G NR base stations, optical network switches
Industrial: Motor control, machine vision systems
Automotive: ADAS sensor fusion, LiDAR processing
Healthcare: MRI image reconstruction, ultrasound beamforming
Aerospace: Satellite communication modems, flight control systems

6. Leading Manufacturers and Products

Vendor	Representative Product	Key Features
Xilinx	Zynq UltraScale+ MPSoC	Quad-core ARM Cortex-A53 + 1.6M logic cells
Intel	Stratix 10 GX	10M logic elements, 14 Gbps transceivers
Lattice	MachXO3D	Low-power <100K LUTs with security features
Microchip	PolarFire SoC	256-bit RISC-V processor, 4.9M logic cells

7. Selection Guidelines

Key considerations:

Evaluate required logic density and I/O bandwidth
Balance performance vs. power budget (e.g., automotive vs. data center)
Assess toolchain support (Vivado, Quartus, etc.)
Consider long-term availability for industrial/medical systems
Verify protocol compatibility (e.g., PCIe Gen5, DDR5)

8. Industry Trends

Future directions include:

AI-optimized FPGAs with integrated tensor cores
3D-stacked memory integration for >1 TB/s bandwidth
Open-source toolchain adoption (e.g., GHDL, Yosys)
Heterogeneous computing with hybrid CPU-GPU-FPGA architectures
Advanced node processes (5nm/3nm) enabling 10M+ logic cells