| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
ICP DAS USA Inc. |
COMPACT MODBUS RTU REMOTE I/O DA |
30 |
|
 |
Panasonic |
INPUT MODULE 8 ANALOG |
3 |
|
 |
Delta Electronics |
AS300 IO MODULE - 8 DIGITAL INPU |
10 |
|
 |
ICP DAS USA Inc. |
4 CHANNEL ANALOG OUTPUTS, 5 CHAN |
30 |
|
 |
Delta Electronics |
AS300 IO MODULE - 4 ANALOG OUTPU |
5 |
|
 |
Phoenix Contact |
OUTPUT MODULE 1 RELAY |
0 |
|
 |
Phoenix Contact |
COMMUNICATIONS MODULE 24V |
0 |
|
 |
Phoenix Contact |
INPUT MODULE 2 ANALOG 24V |
0 |
|
 |
Omron Automation & Safety Services |
COMMUNICATIONS MODULE 5-24V |
6 |
|
 |
Control By Web |
WEB-ENABLED TEMP & HUMIDITY MOD. |
25 |
|
 |
GP Systems GmbH |
CPU MODULE, ARM CORTEX AX, 512 M |
0 |
|
 |
IDEC |
PID MODULE ANALOG OUTPUT |
2 |
|
 |
ICP DAS USA Inc. |
DEVICENET SLAVE I/O MODULE: 16 C |
30 |
|
 |
ICP DAS USA Inc. |
MODBUS RTU RS-485 REMOTE I/O DAQ |
30 |
|
 |
ICP DAS USA Inc. |
RS-485 REMOTE I/O DAQ MODULE: AN |
30 |
|
 |
Phoenix Contact |
POWER SUPPLY MODULE 24V |
0 |
|
 |
IDEC |
16IN 8OUT EXP MODULE 24VDC RLY |
3 |
|
 |
Panasonic |
COMMUNICATIONS MODULE |
0 |
|
 |
ICP DAS USA Inc. |
MODBUS TCP POE REMOTE I/O DAQ MO |
30 |
|
 |
IDEC |
8PT 24VDC EXP MODULE SCREW |
3 |
|
Programmable Logic Controller (PLC) modules are core components of industrial automation systems. They are digital computers designed for real-time control of manufacturing processes, machinery, and production lines. By processing inputs from sensors and outputs to actuators, PLC modules enable precise logic control, sequence control, and data handling. Their reliability, flexibility, and scalability make them critical in modern industries for optimizing efficiency, reducing downtime, and ensuring safe operations.
| Type | Functional Features | Application Examples |
|---|---|---|
| CPU Modules | Central processing units for executing control logic and managing system tasks | Assembly line control systems |
| Input/Output (I/O) Modules | Digital/analog signal acquisition and output control | Temperature monitoring in chemical plants |
| Communication Modules | Support industrial protocols (Ethernet/IP, Profibus, Modbus) | Connecting to SCADA systems |
| Power Supply Modules | Convert AC/DC power for system operation | Stable power for factory automation |
| Special Function Modules | High-speed counters, positioning control, or temperature compensation | Precision motion control in robotics |
A typical PLC module consists of: - Enclosure: Industrial-grade housing with IP protection rating - Circuit Boards: Multi-layer PCB with embedded processors and memory - I/O Terminals: Screw/clamp connectors for field device integration - Backplane Interfaces: For module interconnection and data exchange - Heat Dissipation Elements: Aluminum heat sinks or cooling fans - Power Management Circuitry: Overload and surge protection
| Parameter | Description | Importance |
|---|---|---|
| Processing Speed | 0.01-10 s per instruction | Determines real-time response capability |
| I/O Capacity | 8-2048 points per module | Defines system scalability |
| Communication Protocols | Ethernet/IP, PROFINET, CANopen | Enables industrial network integration |
| Operating Temperature | -20 C to 70 C | Affects reliability in harsh environments |
| Power Consumption | 5-50 W per module | Impacts system energy efficiency |
| Programming Standards | IEC 61131-3 compliant languages | Ensures software compatibility |
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Siemens | SIMATIC S7-1500 | 0.01 s processing speed, PROFINET interface |
| Rockwell Automation | ControlLogix 5580 | Integrated motion control, 4GB memory |
| Mitsubishi Electric | Fx5 Series | Compact design, built-in USB programming |
| Schneider Electric | Modicon M580 | Web-server based configuration, Ethernet/IP |
| Omron | CP1L | Onboard analog I/O, pulse output |
Key considerations for PLC module selection:
Current trends shaping PLC module development include: - Industrial IoT Integration: Embedded connectivity for predictive maintenance - Edge Computing: Local data processing with AI capabilities - Cybersecurity Enhancement: Built-in protection against network attacks - Modular Design: Hot-swappable components for minimal downtime - Energy Efficiency: Low-power processors for sustainable manufacturing - Cloud Connectivity: Direct integration with enterprise-level systems