Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
9690.0100

9690.0100

Schurter

ROUND STANDOFF M4 NYLON 51MM

644

9831.6300

9831.6300

Schurter

ROUND STANDOFF M3 NYLON 16MM

2710500

9842.5300

9842.5300

Schurter

ROUND STANDOFF M4 NYLON 25MM

366

9652.5200

9652.5200

Schurter

HEX STANDOFF M5 NYLON 25MM

48100

9865.1200

9865.1200

Schurter

ROUND STANDOFF M6 NYLON 51MM

265

9652.2300

9652.2300

Schurter

HEX STANDOFF M5 NYLON 22MM

5

9865.1300

9865.1300

Schurter

ROUND STANDOFF M6 NYLON 51MM

401

9631.3200

9631.3200

Schurter

HEX STANDOFF M3 NYLON 13MM

3127500

9841.9300

9841.9300

Schurter

ROUND STANDOFF M4 NYLON 19MM

71

9852.5200

9852.5200

Schurter

ROUND STANDOFF M5 NYLON 25MM

43

9852.2100

9852.2100

Schurter

ROUND STANDOFF M5 NYLON 22MM

380

9831.3300

9831.3300

Schurter

ROUND STANDOFF M3 NYLON 13MM

30572700

9646.4300

9646.4300

Schurter

HEX STANDOFF M4 NYLON 64MM

1488

9663.2300

9663.2300

Schurter

HEX STANDOFF M6 NYLON 32MM

414200

9641.6300

9641.6300

Schurter

HEX STANDOFF M4 NYLON 16MM

1399

9652.2200

9652.2200

Schurter

HEX STANDOFF M5 NYLON 22MM

868

9831.3100

9831.3100

Schurter

ROUND STANDOFF M3 NYLON 13MM

1676

9632.5200

9632.5200

Schurter

HEX STANDOFF M3 NYLON 25MM

10856400

9665.1300

9665.1300

Schurter

HEX STANDOFF M6 NYLON 51MM

280

9653.8200

9653.8200

Schurter

HEX STANDOFF M5 NYLON 38MM

228

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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