Board Spacers, Standoffs

Image Part Number Description / PDF Quantity Rfq
9652.2100

9652.2100

Schurter

HEX STANDOFF M5 NYLON 22MM

3100

9855.1200

9855.1200

Schurter

ROUND STANDOFF M5 NYLON 51MM

23

9641.6200

9641.6200

Schurter

HEX STANDOFF M4 NYLON 16MM

461500

9863.8200

9863.8200

Schurter

ROUND STANDOFF M6 NYLON 38MM

269

9863.2200

9863.2200

Schurter

ROUND STANDOFF M6 NYLON 32MM

528

9863.2100

9863.2100

Schurter

ROUND STANDOFF M6 NYLON 32MM

893

9842.5200

9842.5200

Schurter

ROUND STANDOFF M4 NYLON 25MM

1688

9633.8300

9633.8300

Schurter

HEX STANDOFF M3 NYLON 38MM

1350

9663.2100

9663.2100

Schurter

HEX STANDOFF M6 NYLON 32MM

114

9663.8200

9663.8200

Schurter

HEX STANDOFF M6 NYLON 38MM

101

9854.5200

9854.5200

Schurter

ROUND STANDOFF M5 NYLON 45MM

401

9643.8200

9643.8200

Schurter

HEX STANDOFF M4 NYLON 38MM

1075

9645.1300

9645.1300

Schurter

HEX STANDOFF M4 NYLON 51MM

509

9833.8300

9833.8300

Schurter

ROUND STANDOFF M3 NYLON 38MM

944

9831.9300

9831.9300

Schurter

ROUND STANDOFF M3 NYLON 19MM

582

9852.2300

9852.2300

Schurter

ROUND STANDOFF M5 NYLON 22MM

1405

9631.3300

9631.3300

Schurter

HEX STANDOFF M3 NYLON 13MM

3364100

9655.1200

9655.1200

Schurter

HEX STANDOFF M5 NYLON 51MM

767

9832.5300

9832.5300

Schurter

ROUND STANDOFF M3 NYLON 25MM

305

9632.5100

9632.5100

Schurter

HEX STANDOFF M3 NYLON 25MM

130100

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

TypeFunctional FeaturesApplication Examples
Cylindrical SpacersSimple tubular design with uniform diameterPCB layer separation in consumer electronics
Hexagonal Standoffs6-sided structure for wrench tighteningIndustrial equipment panel mounting
Self-clinching StandoffsPermanent installation with threaded compressionSheet metal enclosures in servers
Adjustable SpacersVariable length through threaded adjustmentPrototype development and testing
Insulated SpacersNon-conductive materials for electrical isolationHigh-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

  • Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
  • Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
  • Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
  • Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

ParameterImportance
Material Hardness (HV)Determines wear resistance and load capacity
Thread Engagement LengthAffects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)Safety factor in high-voltage applications
Installation Torque RatingPrevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

  • Electronics Manufacturing: Server racks, LED displays
  • Automotive: Engine control units (ECUs), ADAS systems
  • Aerospace: Satellite PCB mounting, avionics enclosures
  • Medical Devices: MRI scanner internal structures
  • Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

ManufacturerRepresentative Product
PEMS-8900 Series self-clinching standoffs
RS Components486-8826 insulated hexagonal spacers
Mouser Electronics925206-12 adjustable PCB spacers
McMaster-Carr91285A102 stainless steel standoffs

7. Selection Recommendations

  • Evaluate mechanical load requirements vs material strength
  • Match thread type (UNC/UNF/Metric) with assembly hardware
  • Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
  • Select insulated variants for >50V circuits
  • Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

  • Miniaturization: Sub-1mm spacers for wearable devices
  • Material Innovation: Conductive polymer composites for EMI shielding
  • Smart Integration: Standoffs with embedded strain gauges for structural monitoring
  • Automated Installation: Self-aligning designs for robotic assembly lines
  • Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production
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