Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
1183-10-N RAF	5/16 RD X 2.00 X .192 ID	200
971270354 Würth Elektronik Midcom	BRASS SPACER STUD METRIC THREAD	257
970140321 Würth Elektronik Midcom	HEX SPACER M3X0.5 STEEL 14MM	185
R30-6700794 Harwin	ROUND SPACER M3 NYLON 7MM	2583
13RS075031 Richco, Inc. (Essentra Components)	ROUND SPACER, .315 ID, .750 OD,	2500
4500-632-SS RAF	HEX STANDOFF #6-32 SS 3/16"	3936
TN6-40-832-1 Richco, Inc. (Essentra Components)	RND STANDOFF #8-32 NYLON 2-1/2"	400
2104-440-SS RAF	HEX STANDOFF #4-40 SS 1/2"	262
13SP183 Richco, Inc. (Essentra Components)	ROUND THROUGH SPACER, NATURAL, N	20000
8428 Keystone Electronics Corp.	HEX STANDOFF #8-32 ALUMINUM 5/8"	844700
4549-440-AL RAF	HEX STANDOFF #4-40 ALUM 36.53MM	1488
M2234-4007-SS RAF	10MM X 19MM X M4 THD	150
971350476 Würth Elektronik Midcom	ALUMINIUM SPACER STUD METRIC THR	246
M1310-3005-B-5 RAF	6MM HEX X 13MM X M3 THD	200
7671 Keystone Electronics Corp.	RND STNDFF 1/4-20 CERAMIC 1-1/4	4480
36832MF087 Richco, Inc. (Essentra Components)	MALE FEMALE THREADED STANDOFF, #	2000
M1377-5008-S-12 RAF	8MM HEX X 40MM X M5 THD	187
MFTS6-6-48 Richco, Inc. (Essentra Components)	HEX STANDOFF #6-32 NYLON 3/8"	0
971550471 Würth Elektronik Midcom	HEX STANDOFF M4X0.7 STEEL 55MM	1374
13RSSR0015 Richco, Inc. (Essentra Components)	ROUND SPACER, .090 ID, .188 OD,	1800

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production