Board Spacers, Standoffs

Part Number	Description / PDF	Quantity
13SP329 Richco, Inc. (Essentra Components)	ROUND SPACER, .140 ID, .250 OD,	4976
1802D Keystone Electronics Corp.	ROUND STANDOFF #2-56 BRASS 3/8"	5479
3547-C-440-B RAF	1/4_HEX_SWAGE_STANDOFFS	1990
13RS016040 Richco, Inc. (Essentra Components)	ROUND SPACER, .100 ID, .160 OD,	1917
13RS081225 Richco, Inc. (Essentra Components)	ROUND SPACER, .688 ID, .805 OD,	500
7215 Keystone Electronics Corp.	HEX STANDOFF #6-32 BRASS 1-3/4"	1555231
13RS031244 Richco, Inc. (Essentra Components)	ROUND SPACER, .194 ID, .312 OD,	1000
4613-632-AL RAF	5/16 HEX X 4-1/2 LENGTH	440
NAS1831C4C10 RAF	STAINLESS STEEL 1/4 HEX FEMALE S	498
4936 Keystone Electronics Corp.	HEX STANDOFF #8-32 NYLON 3/4"	13201100
M2106-2545-SS RAF	HEX STANDOFF M2.5X0.45 SS 11MM	506
M1309-3005-SS-20 RAF	6MM HEX X 12MM X M3 THD	0
1124T-4-B RAF	1_4-ROUND_SPACER	715
NAS1831AC4B16 RAF	ALUMINUM 1/4 HEX FEMALE STANDOFF	0
13RSSR0231 Richco, Inc. (Essentra Components)	ROUND SPACER, .505 ID, 1.000 OD,	1000
CBTS145A Richco, Inc. (Essentra Components)	HEX STANDOFF M3 NYLON 42MM	32
13RS012504 Richco, Inc. (Essentra Components)	ROUND SPACER, .047 ID, .125 OD,	3840
NAS1829C4E25 RAF	STAINLESS STEEL 1/4 HEX MALE/FEM	125
NAS42DD4A-31A RAF	ALUMINUM UNTHREADED SPACER 3/16	0
970100366 Würth Elektronik Midcom	ALUMINIUM SPACER STUD METRIC THR	462

Board Spacers, Standoffs

1. Overview

Board spacers and standoffs are specialized hardware components used to create controlled spacing between printed circuit boards (PCBs), panels, or structural elements. They provide mechanical support, electrical isolation, and thermal management in electronic assemblies. Their importance in modern technology includes enabling compact designs, reducing vibration stress, and improving heat dissipation in devices ranging from smartphones to industrial control systems.

2. Main Types & Functional Classification

Type	Functional Features	Application Examples
Cylindrical Spacers	Simple tubular design with uniform diameter	PCB layer separation in consumer electronics
Hexagonal Standoffs	6-sided structure for wrench tightening	Industrial equipment panel mounting
Self-clinching Standoffs	Permanent installation with threaded compression	Sheet metal enclosures in servers
Adjustable Spacers	Variable length through threaded adjustment	Prototype development and testing
Insulated Spacers	Non-conductive materials for electrical isolation	High-voltage power supply assemblies

3. Structure & Composition

Typical construction includes:

Material: Stainless steel (corrosion resistance), aluminum (lightweight), or nylon (insulation)
Geometry: Cylindrical (standard), stepped (for multiple board heights), or flanged (for load distribution)
Installation Features: Internal threading (male/female), knurled surfaces (for grip), or press-fit tabs
Surface Treatment: Passivation (metal), UV resistance (plastics), or EMI shielding coating

4. Key Technical Specifications

Parameter	Importance
Material Hardness (HV)	Determines wear resistance and load capacity
Thread Engagement Length	Affects vibration resistance in dynamic environments
Thermal Conductivity (W/m K)	Critical for heat dissipation in power electronics
Dielectric Strength (kV/mm)	Safety factor in high-voltage applications
Installation Torque Rating	Prevents over-tightening damage to PCBs

5. Application Fields

Primary industries include:

Electronics Manufacturing: Server racks, LED displays
Automotive: Engine control units (ECUs), ADAS systems
Aerospace: Satellite PCB mounting, avionics enclosures
Medical Devices: MRI scanner internal structures
Consumer Electronics: Smartphone PCB stacking

6. Leading Manufacturers & Products

Manufacturer	Representative Product
PEM	S-8900 Series self-clinching standoffs
RS Components	486-8826 insulated hexagonal spacers
Mouser Electronics	925206-12 adjustable PCB spacers
McMaster-Carr	91285A102 stainless steel standoffs

7. Selection Recommendations

Evaluate mechanical load requirements vs material strength
Match thread type (UNC/UNF/Metric) with assembly hardware
Consider CTE (Coefficient of Thermal Expansion) compatibility with PCB materials
Select insulated variants for >50V circuits
Use vibration-damping coatings in mobile applications

8. Industry Trends

Emerging developments include:

Miniaturization: Sub-1mm spacers for wearable devices
Material Innovation: Conductive polymer composites for EMI shielding
Smart Integration: Standoffs with embedded strain gauges for structural monitoring
Automated Installation: Self-aligning designs for robotic assembly lines
Sustainability: Biodegradable plastic options (PLA-based) entering mainstream production