Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
2512063017Y3 Fair-Rite Products Corp.	FERRITE BEAD 1206 1LN	42145
Z0201C241ASMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	15000
2508056007Y0 Fair-Rite Products Corp.	FERRITE BEAD 0805 1LN	17354
742792907 Würth Elektronik Midcom	FERRITE BEAD 240 OHM 2SMD 1LN	360
BLM03BD121SN1D TOKO / Murata	FERRITE BEAD 120 OHM 0201 1LN	0
MMZ1005Y400CT000 TDK Corporation	FERRITE BEAD 40 OHM 0402 1LN	28749
MMZ1608S800ATA00 TDK Corporation	FERRITE BEAD 80 OHM 0603 1LN	1869
MFBW1V1608-800-R PowerStor (Eaton)	FIXED IND 80 1000MA 0603	0
CIM03U241NC Samsung Electro-Mechanics	FERRITE BEAD 240 OHM 0201 1LN	8500
FB20010-3B-RC J.W. Miller / Bourns	FERRITE BEAD 780 OHM AXIAL 1LN	4235
782632102 Würth Elektronik Midcom	FERRITE BEAD 1 KOHM 0603 1LN	14740
MAF1608FAD151CT000 TDK Corporation	FERRITE BEAD 150 OHM 0603 1LN	2530
MFBW1V3216-700-R PowerStor (Eaton)	FIXED IND 70 3000MA 1206	995
BBUP00160808121Y00 Chilisin Electronics	EMI BEAD FILETER	6942
MMZ0603S800HT000 TDK Corporation	FERRITE BEAD 80 OHM 0201 1LN	19070
Z0201C102GSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	0
BLM15AX100SN1D TOKO / Murata	FERRITE BEAD 10 OHM 0402 1LN	38828
742792511 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 1812 1LN	50236
FBMH3225HM601NTV TAIYO YUDEN	FERRITE BEAD 600 OHM 1210 1LN	14209
742792910 Würth Elektronik Midcom	FERRITE BEAD 200 OHM 2SMD 1LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems