Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
Z1206C380BPWST KEMET	POWER LINE FERRITE CHIP BEAD 38,	1975
BLM18BD222SN1D TOKO / Murata	FERRITE BEAD 2.2 KOHM 0603 1LN	3083
MMZ2012S102AT000 TDK Corporation	FERRITE BEAD 1 KOHM 0805 1LN	6896
BLM21RK601SN1D TOKO / Murata	FERRITE BEAD 600 OHM 0805 1LN	0
7427501 Würth Elektronik Midcom	WE-UKW EMI SUPPRESSION 6-HOLE FE	0
742792510 Würth Elektronik Midcom	FERRITE BEAD 70 OHM 1812 1LN	7238
BLM03BD241SN1D TOKO / Murata	FERRITE BEAD 240 OHM 0201 1LN	43815
BLM21BB151SH1D TOKO / Murata	FERRITE CHIP 150 OHM 0805	0
BLM18BD152BH1D TOKO / Murata	FERRITE BEAD 1.5 KOHM 0603 1 LN	156
MFBW1V2012-201-R PowerStor (Eaton)	FIXED IND 200 2000MA 0805	0
BLM21SP601SH1D TOKO / Murata	FERRITEBEAD SMD Z100MHZ=600OHM 2	604
HI1206N800R-10 Laird - Performance Materials	FERRITE BEAD 80 OHM 1206 1LN	113776
BBPY00321611300Y00 Chilisin Electronics	EMI BEAD FILETER	1856
782762301 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 1206 1LN	1322
MU1608-471Y J.W. Miller / Bourns	FERRITE BEAD 470 OHM 0603 1LN	0
782632121 Würth Elektronik Midcom	FERRITE BEAD 120 OHM 0603 1LN	628
ILB1206ER700V Vishay / Dale	FERRITE BEAD 70 OHM 1206 1LN	9161
ILBB0603ER121V Vishay / Dale	FERRITE BEAD 120 OHM 0603 1LN	8448
KMZ1608RHR121ATD25 TDK Corporation	FERRITE BEAD 120 OHM 0603 1LN	3510
MMZ1005D121CTD25 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	6023

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems