Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
BLM21BD601SN1D TOKO / Murata	FERRITE BEAD 600 OHM 0805 1LN	7782
BLM02AX241SN1D TOKO / Murata	FERRITE CHIP 240 OHM 250MA 01005	0
Z0805C241BSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	4000
FBMH2012HM121-TV TAIYO YUDEN	FERRITE BEAD 120 OHM 0805 1LN	5304
BBNQ00160808601Y00 Chilisin Electronics	EMI BEAD FILETER	2415
ACML-0402-102-T Abracon	FERRITE BEAD 1 KOHM 0402 1LN	0
74279272 Würth Elektronik Midcom	FERRITE BEAD 300 OHM 0402 1LN	75090
AWBC-09 Abracon	FERRITE BEAD 800 OHM AXIAL 1 LN	432
MAF0603GWY551AT000 TDK Corporation	NOISE SUPPRESSION FILTER FOR AUD	29289
MI0805K601R-10 Laird - Performance Materials	FERRITE BEAD 600 OHM 0805 1LN	0
BLM21SP700SH1D TOKO / Murata	FERRITEBEAD SMD Z100MHZ=70OHM 6A	0
BLM21BB600SN1D TOKO / Murata	FERRITE BEAD 60 OHM 0805 1LN	6394
BLM21PG331SN1D TOKO / Murata	FERRITE BEAD 330 OHM 0805 1LN	41316
7427932 Würth Elektronik Midcom	FERRITE BEAD 98 OHM 2SMD 1LN	854
2508053006Y3 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0
BK1005HW121-TV TAIYO YUDEN	FERRITE BEAD 120 OHM 0402 1LN	2501
MMZ2012R600AT000 TDK Corporation	FERRITE BEAD 60 OHM 0805 1LN	34317
MMZ0402D220CT000 TDK Corporation	FERRITE BEAD 22 OHM 01005 1LN	6502
MMZ1608Q331BTD25 TDK Corporation	FERRITE BEAD 330 OHM 0603 1LN	1538
Z0603C241ESMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	2975

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems