Ferrite Beads and Chips

Part Number	Description / PDF	Quantity
HF50ACC321611-TD25 TDK Corporation	FERRITE BEAD 31 OHM 1206 1LN	390
MMZ1608B102CTD25 TDK Corporation	FERRITE BEAD 1 KOHM 0603 1LN	1639
BLM18DN151SN1D TOKO / Murata	FERRITEBEAD SMD Z100MHZ=150OHM 1	5475
ACML-0603-152-T Abracon	FERRITE BEAD 1.5 KOHM 0603 1LN	0
74279224181 Würth Elektronik Midcom	FERRITE BEAD 180 OHM 2220 1LN	189
MMZ2012S102ATD25 TDK Corporation	FERRITE BEAD 1 KOHM 0805 1LN	8788
BBPY00160808601Y00 Chilisin Electronics	EMI BEAD FILETER	4477
ACML-0805-800-T Abracon	FERRITE BEAD 80 OHM 0805 1LN	15295
MFBW1V2012-110-R PowerStor (Eaton)	FIXED IND 11 3000MA 0805	0
BLM18BD421SH1D TOKO / Murata	FERRITE CHIP 420 OHM 200MA 0603	0
ACML-0603-181-T Abracon	FERRITE BEAD 180 OHM 0603 1LN	0
2512065008Y3 Fair-Rite Products Corp.	MULTI-LAYER CHIP BEAD	0
Z0201C100CSMST KEMET	SIGNAL LINE EMI FERRITE CHIP BEA	15000
MFBM1V2012-070-R PowerStor (Eaton)	FIXED IND 7 6000MA 0805	0
MMZ1005S241AT000 TDK Corporation	FERRITE BEAD 240 OHM 0402 1LN	5707
BLA2ABD601SN4D TOKO / Murata	FERRITE BEAD 600 OHM 0804 4LN	7736
BBPY00321611601Y00 Chilisin Electronics	EMI BEAD FILETER	5400
MMZ1005Y601CTD25 TDK Corporation	FERRITE BEAD 600 OHM 0402 1LN	2863
MMZ1005S121CT000 TDK Corporation	FERRITE BEAD 120 OHM 0402 1LN	90312
2506030707H0 Fair-Rite Products Corp.	FERRITE BEAD 0603 1LN	0

Ferrite Beads and Chips

1. Overview

Ferrite beads and chips are passive electronic components designed to suppress high-frequency noise in electrical circuits. Made from ferrite materials (iron oxide compounds), they act as low-pass filters by dissipating electromagnetic interference (EMI) as heat. Their importance in modern electronics lies in ensuring signal integrity, reducing radio-frequency interference (RFI), and complying with electromagnetic compatibility (EMC) standards. They are widely used in power supplies, communication systems, and high-speed digital circuits.

2. Main Types and Functional Classification

Type	Functional Features	Application Examples
High-Frequency Ferrite Beads	Optimized for GHz-range noise suppression, low core loss	5G transceivers, RF modules
Low-Frequency Ferrite Beads	Effective at MHz-range filtering, high impedance stability	Power supplies, motor drives
High-Current Chips	Designed for >1A applications, thermal stability	EV battery management systems
Multilayer Ferrite Chips	Stacked structure for broadband filtering	Smartphones, IoT devices

3. Structure and Composition

Typical construction includes:

Ferrite Core: Mn-Zn or Ni-Zn based ceramic material
Electrodes: Silver-palladium (AgPd) or copper-nickel (CuNi) terminations
Encapsulation: Epoxy or polymer coating for mechanical protection
Geometry: Available in cylindrical (beads) or rectangular (chips) formats

Advanced designs incorporate internal electrode layers to increase impedance density.

4. Key Technical Parameters

Parameter	Description	Importance
Impedance (Z)	100MHz @ 100 -10k	Determines noise suppression efficiency
Rated Current	100mA-10A	Affects circuit stability under load
Frequency Range	1MHz-10GHz	Defines operational bandwidth
DC Resistance (DCR)	0.1 -20	Impacts power loss and heating
Operating Temp.	-55 C to +150 C	Ensures reliability in extreme conditions

5. Application Areas

Consumer Electronics: Smartphones (camera module filtering), laptops (power line conditioning)
Automotive: EV charging systems (CAN bus noise suppression), ADAS sensors
Industrial: PLCs (programmable logic controllers), motor drives
Telecom: Base stations (RF front-end filtering), optical transceivers

6. Leading Manufacturers and Products

Manufacturer	Key Products	Specifications
Murata	BLSH series	0.7A, 600 @ 100MHz, EIA 0603
TDK	MMZ series	3.0A, 2200 @ 100MHz, EIA 1210
Coilcraft	0603LS series	1.5A, 500 @ 100MHz, 0.65mm height
W rth Elektronik	744300 series	2.0A, 1500 @ 100MHz, AEC-Q200 qualified

7. Selection Guidelines

Define frequency range: Choose Ni-Zn for >100MHz applications, Mn-Zn for low frequencies
Calculate current requirements: Select rated current 20% higher than maximum operating current
Impedance matching: Ensure Z 10 source/load impedance at target frequency
Package constraints: Prioritize chip format for space-limited PCB designs
Environmental factors: Consider temperature rating for automotive/industrial applications
Cost optimization: Balance performance needs with standard vs. high-end part pricing

8. Industry Trends

Key development directions include:

Miniaturization: Development of 0201/01005 chip sizes for wearable devices
High-frequency performance: Materials enabling stable operation beyond 10GHz
Integrated solutions: Combining ferrite beads with capacitors in single packages
Material innovation: Lead-free and low-temperature co-fired ceramic (LTCC) technologies
Automotive focus: AEC-Q qualified parts for EV/HEV power systems