Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
387004680

387004680

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

33

430122-520

430122-520

Laird Thermal Systems

PELTIER CP2,127,06,L1,RT,W4.5

0

9340002-301

9340002-301

Laird Thermal Systems

PELTIR MS2,107,10,10,12,12,11,W8

0

387004938

387004938

Laird Thermal Systems

ETX4-12-F2-4040-TA-RT-W6

20

9340002-302

9340002-302

Laird Thermal Systems

MS2,107,10,10,12,12,11,RT,W8

0

71036-505

71036-505

Laird Thermal Systems

PELTIER CP08,63,06,L1,W4.5

1617

9340006-301

9340006-301

Laird Thermal Systems

PELTIER MS5,257,10,15,11,W8

5

430848-509

430848-509

Laird Thermal Systems

PELTIER CP12,161,04,L1,RT,W4.5

54

430887-301

430887-301

Laird Thermal Systems

PELTIER OT24,31,F1,1010,TA,W2.25

38

430680-582

430680-582

Laird Thermal Systems

THERMOELECT

13

71012-506

71012-506

Laird Thermal Systems

PELTIER MOD CP10,254,06,L1,W4.5

23

430011-501

430011-501

Laird Thermal Systems

PELTIER OT12,66,F0,1211,11,W2.25

0

430544-501

430544-501

Laird Thermal Systems

PELTIR ET20,24,F2A,0709,11,W2.25

9

430581-502

430581-502

Laird Thermal Systems

PELTIR ET20,30,F2A,0610,11,W2.25

14

387004911

387004911

Laird Thermal Systems

ETX4-12-F1-3030-TA-W6

0

430436-501

430436-501

Laird Thermal Systems

PELTIER CP10,71,06,L,RT,W4.5

21

387004711

387004711

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

24

430285-513

430285-513

Laird Thermal Systems

PELTIER HT6,12,F2,4040,TA,RT,W6

4

9340003-301

9340003-301

Laird Thermal Systems

PELTIR MS2,190,10,10,12,12,11,W8

5

430011-507

430011-507

Laird Thermal Systems

OT12,66,F0,1211,11,RT,W2.25

2

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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