Thermal - Thermoelectric, Peltier Modules

Image Part Number Description / PDF Quantity Rfq
387004679

387004679

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

8

66195-504

66195-504

Laird Thermal Systems

PELTIER CP08,127,06,L1,RT,W4.5

202

387004713

387004713

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

10

387004960

387004960

Laird Thermal Systems

ETX2.3-4-F1-1919-TA-RT-W6

0

430478-502

430478-502

Laird Thermal Systems

PELTIER SH14,125,06,L1,W4.5

36

9340003-304

9340003-304

Laird Thermal Systems

PELTIR MS2,190,10,10,12,12,00,W8

12

430779-501

430779-501

Laird Thermal Systems

PELTIR OT12,18,F2A,0606,11,W2.25

0

387004943

387004943

Laird Thermal Systems

ETX6-3-F1-2020-TA-RT-W6

15

56590-502

56590-502

Laird Thermal Systems

PELTIER MOD CP14,71,10,L1,W4.5

523

430104-503

430104-503

Laird Thermal Systems

HOT12,65,F2A,1312,22,RT,W2.25

86

387001836

387001836

Laird Thermal Systems

ET7,3,F1,2020,TA,RT,W4.5

41

387001768

387001768

Laird Thermal Systems

ET4,12,F2,4040,TA,RT,W6

16

430138-506

430138-506

Laird Thermal Systems

PELTIER HT2,12,F2,3030,TA,RT,W6

24

387004917

387004917

Laird Thermal Systems

ETX6-12-F1-4040-TA-RT-W6

24

430037-515

430037-515

Laird Thermal Systems

HOT12,18,F2A,0606,TB,W2.29

38

430027-501

430027-501

Laird Thermal Systems

PELTIER MOD 34X30X3.81MM 6A

36

430764-507

430764-507

Laird Thermal Systems

PELTIER UT15,12,F2,4040,TA,RT,W6

0

430887-302

430887-302

Laird Thermal Systems

PLTR OT24,31,F1,1010,11,GG,W2.25

10

387001841

387001841

Laird Thermal Systems

ET9,3,F2,2525,TA,RT,W6

0

387004692

387004692

Laird Thermal Systems

ULTRATEC UTX SERIES, THERMOELECT

28

Thermal - Thermoelectric, Peltier Modules

1. Overview

Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Standard TEMsBalanced cooling capacity and costIndustrial temperature control systems
High-Power TEMsHigh T (temperature difference) and large heat pumping capacityLaser diode cooling, power electronics
Microminiature TEMsSub-centimeter dimensions with precise thermal regulationMedical sensors, infrared detectors
Multistage TEMsCascaded design for ultra-low temperature applicationsCryogenic systems, scientific instruments

3. Structure and Components

A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)

4. Key Technical Specifications

ParameterDescriptionImportance
Qmax (W)Maximum heat pumping capacityDetermines cooling capability
Tmax ( C)Maximum temperature differenceDefines operational limits
Imax (A)Maximum operating currentImpacts power consumption
ZT ValueThermoelectric figure of meritMaterial efficiency indicator
Dimensions (mm)Physical sizeIntegration constraints

5. Application Fields

Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling

6. Leading Manufacturers and Products

ManufacturerRepresentative ProductKey Features
Laird Thermal SystemsHiTemp Series Tmax=72 C, 200W capacity
TE ConnectivityCP Series TECMiniature 10 10mm footprint
II-VI IncorporatedLaser Diode CoolerHigh-reliability multistage design

7. Selection Recommendations

Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs

8. Industry Trends

Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries

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