| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
Marlow Industries, Inc. |
TEM 20.1X20.1X3.53MM |
53 |
|
|
Marlow Industries, Inc. |
TEM 30X34X3.93MM |
18 |
|
|
Marlow Industries, Inc. |
TEM THERMOCYCLER 40X40X3.84MM |
25 |
|
|
Marlow Industries, Inc. |
TEG GENERATOR 40.13X40.13X3.53MM |
30 |
|
|
Marlow Industries, Inc. |
TEG GENERATOR 30X30X3.94MM |
34 |
|
|
Marlow Industries, Inc. |
MULTISTAGE TEM 10.97X9.88X3.76MM |
1 |
|
 |
Marlow Industries, Inc. |
MULTISTAGE TEM 40X40X8MM |
0 |
|
 |
Marlow Industries, Inc. |
MULTISTAGE TEM 40X40X8MM |
0 |
|
|
Marlow Industries, Inc. |
MULTISTAGE TEM 40X40X8.15MM |
0 |
|
Thermoelectric Peltier Modules (TEMs) are solid-state devices that utilize the Peltier effect to transfer heat between two electrical junctions. When direct current (DC) passes through a thermoelectric material, heat is absorbed on one side and released on the opposite side. These modules enable precise temperature control without moving parts, refrigerants, or maintenance, making them critical in modern electronics, medical devices, and industrial systems.
| Type | Functional Features | Application Examples |
|---|---|---|
| Standard TEMs | Balanced cooling capacity and cost | Industrial temperature control systems |
| High-Power TEMs | High T (temperature difference) and large heat pumping capacity | Laser diode cooling, power electronics |
| Microminiature TEMs | Sub-centimeter dimensions with precise thermal regulation | Medical sensors, infrared detectors |
| Multistage TEMs | Cascaded design for ultra-low temperature applications | Cryogenic systems, scientific instruments |
A typical Peltier module consists of: - Ceramic substrates (high thermal conductivity electrical insulation) - Thermoelectric elements (Bismuth Telluride - Bi2Te3 based semiconductors) - Copper interconnects (low electrical resistance) - Solder junctions (thermal and electrical bonding) - Epoxy encapsulation (moisture protection)
| Parameter | Description | Importance |
|---|---|---|
| Qmax (W) | Maximum heat pumping capacity | Determines cooling capability |
| Tmax ( C) | Maximum temperature difference | Defines operational limits |
| Imax (A) | Maximum operating current | Impacts power consumption |
| ZT Value | Thermoelectric figure of merit | Material efficiency indicator |
| Dimensions (mm) | Physical size | Integration constraints |
Main industries include: - Electronics: CPU/GPU cooling, telecom equipment - Medical: PCR thermal cyclers, patient care devices Automotive: Battery thermal management, cabin climate control Scientific: Spectroscopy instruments, CCD cooling
| Manufacturer | Representative Product | Key Features |
|---|---|---|
| Laird Thermal Systems | HiTemp Series | Tmax=72 C, 200W capacity |
| TE Connectivity | CP Series TEC | Miniature 10 10mm footprint |
| II-VI Incorporated | Laser Diode Cooler | High-reliability multistage design |
Key considerations: - Required T and heat load calculations - Operating voltage/current compatibility - Physical space constraints - Environmental conditions (humidity, vibration) - Cost vs. efficiency trade-offs
Future developments focus on: - Advanced materials (Skutterudites, silicon-germanium) - Micro-scale integration for mobile devices - Smart modules with PID temperature control - Eco-friendly thermoelectric materials - 3D-printed customized geometries