Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
EYG-R1315ZLGA

EYG-R1315ZLGA

Panasonic

THERM PAD 129.5X150X0.25MM GRAY

10

EYG-S121804DP

EYG-S121804DP

Panasonic

THERM PAD 180MMX115MM GRAY

4

EYG-A121805PA

EYG-A121805PA

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

7

EYG-R0404ZLMP

EYG-R0404ZLMP

Panasonic

THERM PAD 36X38X0.25MM GRAY

0

EYG-A121803DM

EYG-A121803DM

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-S0410ZLSJ

EYG-S0410ZLSJ

Panasonic

THERM PAD 103MMX43MM GRAY

27

EYG-S0309ZLMF

EYG-S0309ZLMF

Panasonic

THERM PAD 92MMX32MM GRAY

0

EYG-R1116ZRSC

EYG-R1116ZRSC

Panasonic

THERM PAD 112X158X0.35MM GRAY

10

EYG-T7070A15A

EYG-T7070A15A

Panasonic

THERM PAD 70MMX70MM W/ADH BLACK

201

EYG-S121803DP

EYG-S121803DP

Panasonic

THERM PAD 180MMX115MM GRAY

19

EYG-S182303

EYG-S182303

Panasonic

THRML MGMT ACCESS THERMAL 1600W/

1889

EYG-T3535A05A

EYG-T3535A05A

Panasonic

THERM PAD 35MMX35MM W/ADH BLACK

232

EYG-A121801DF

EYG-A121801DF

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-T7070A30A

EYG-T7070A30A

Panasonic

THERM PAD 70MMX70MM W/ADH BLACK

184

EYG-A121803M

EYG-A121803M

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

10

EYG-R1313ZRGB

EYG-R1313ZRGB

Panasonic

THERM PAD 128X128X0.35MM GRAY

10

EYG-R0925ZRWA

EYG-R0925ZRWA

Panasonic

THERM PAD 85X246X0.35MM GRAY

10

EYG-A121801A

EYG-A121801A

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-A091207DM

EYG-A091207DM

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-S1212ZLGC

EYG-S1212ZLGC

Panasonic

THERM PAD 120MMX120MM GRAY

7

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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