Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
EYG-S1516ZLSB

EYG-S1516ZLSB

Panasonic

THERM PAD 158MMX148MM GRAY

7

EYG-A091201DF

EYG-A091201DF

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

12

EYG-R0606ZRSL

EYG-R0606ZRSL

Panasonic

THERM PAD 58X61.5X0.35MM GRAY

30

EYG-E0912XB6D

EYG-E0912XB6D

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

15

EYG-A121807V

EYG-A121807V

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-A121810M

EYG-A121810M

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-A091204PM

EYG-A091204PM

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

13

EYG-R0410ZLSJ

EYG-R0410ZLSJ

Panasonic

THERM PAD 43X103X0.25MM GRAY

10

EYG-S0714ZLAF

EYG-S0714ZLAF

Panasonic

THERM PAD 136MMX69MM GRAY

30

EYG-S1313ZLGB

EYG-S1313ZLGB

Panasonic

THERM PAD 128MMX128MM GRAY

6

EYG-A091202RV

EYG-A091202RV

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-S121805

EYG-S121805

Panasonic

THERM PAD 180MMX115MM GRAY

2

EYG-S182307DP

EYG-S182307DP

Panasonic

THERM PAD 230MMX180MM GRAY

190

EYG-T3535A30A

EYG-T3535A30A

Panasonic

THERM PAD 35MMX35MM W/ADH BLACK

119

EYG-R1116ZRMA

EYG-R1116ZRMA

Panasonic

THERM PAD 108.8X158X0.35MM GRAY

10

EYG-A121805DF

EYG-A121805DF

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-S121810

EYG-S121810

Panasonic

THERM PAD 180MMX115MM GRAY

3

EYG-A091203V

EYG-A091203V

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-A091204A

EYG-A091204A

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

14

EYG-A121807DM

EYG-A121807DM

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

26

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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