Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
EYG-E0912XD6D

EYG-E0912XD6D

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

278

EYG-R0509ZLGK

EYG-R0509ZLGK

Panasonic

THERM PAD 46X92X0.25MM GRAY

20

EYG-N0912QE4S

EYG-N0912QE4S

Panasonic

THERM PAD 115MMX90MM W/ADH WHITE

7

EYG-R0612ZLSG

EYG-R0612ZLSG

Panasonic

THERM PAD 61.5X124X0.25MM GRAY

20

EYG-R0911ZRDA

EYG-R0911ZRDA

Panasonic

THERM PAD 109X92X0.35MM GRAY

0

EYG-A091207P

EYG-A091207P

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

12

EYG-R0409ZLMG

EYG-R0409ZLMG

Panasonic

THERM PAD 41X88X0.25MM GRAY

0

EYG-A091203DM

EYG-A091203DM

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-R0714ZLAE

EYG-R0714ZLAE

Panasonic

THERM PAD 70X138X0.25MM GRAY

10

EYG-A121804A

EYG-A121804A

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

89

EYG-S0410ZLAJ

EYG-S0410ZLAJ

Panasonic

THERM PAD 102.8MMX43MM GRAY

24

EYG-R0612ZRSF

EYG-R0612ZRSF

Panasonic

THERM PAD 63.3X124X0.35MM GRAY

0

EYG-R0305ZLSM

EYG-R0305ZLSM

Panasonic

THERM PAD 27X51X0.25MM GRAY

28

EYG-S0508ZLMJ

EYG-S0508ZLMJ

Panasonic

THERM PAD 83MMX46.2MM GRAY

26

EYG-A121807P

EYG-A121807P

Panasonic

THERM PAD 180MMX115MM W/ADH GRAY

0

EYG-S0409ZLMG

EYG-S0409ZLMG

Panasonic

THERM PAD 88MMX41MM GRAY

3

EYG-R0713ZRAG

EYG-R0713ZRAG

Panasonic

THERM PAD 66X126X0.35MM GRAY

9

EYG-R1014ZRAD

EYG-R1014ZRAD

Panasonic

THERM PAD 97.8X138X0.35MM GRAY

10

EYG-A091207M

EYG-A091207M

Panasonic

THERM PAD 115MMX90MM W/ADH GRAY

0

EYG-R1216ZLWD

EYG-R1216ZLWD

Panasonic

THERM PAD 120X160X0.25MM GRAY

6

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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