Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
188761F00000G

188761F00000G

Aavid

HEATSINK

0

188658F00000G

188658F00000G

Aavid

THERM PAD 19.05MMX12.7MM GRAY

0

53-03-12

53-03-12

Aavid

THERM PAD 41.91X28.96MM GRY/GRN

0

5300 6.000

5300 6.000

Aavid

THERM PAD 152.4MX100MM GRAY/GRN

0

53-77-11G

53-77-11G

Aavid

HEATSINK

0

43-77-6G

43-77-6G

Aavid

THERM PAD 20.62MMX14.27MM AMBER

0

189761F00000

189761F00000

Aavid

THERM PAD 19.05MMX10.41MM W/ADH

0

53-77-5G

53-77-5G

Aavid

HEATSINK

0

5300 1.500G

5300 1.500G

Aavid

THERM PAD 100MX38.1MM GRAY/GREEN

0

56-02-10G

56-02-10G

Aavid

HEATSINK

0

189990F00000

189990F00000

Aavid

THERM PAD 21.84MMX18.8MM W/ADH

0

46-77-9G

46-77-9G

Aavid

THERM PAD 18.42MMX13.21MM AMBER

0

188954F00000G

188954F00000G

Aavid

HEATSINK

0

WAVEBLOCKER-A008-30-02-0762-0762

WAVEBLOCKER-A008-30-02-0762-0762

Aavid

PAD WAVEBLOCKER A008 3MM 3X3"

0

WAVEBLOCKER-A008-20-02-0762-0762

WAVEBLOCKER-A008-20-02-0762-0762

Aavid

PAD WAVEBLOCKER A008 2MM 3X3"

0

56-77-20G

56-77-20G

Aavid

INSULATOR

0

53-03-15

53-03-15

Aavid

THERM PAD 40.46X27.94MM GRY/GRN

0

56-77-2G

56-77-2G

Aavid

INSULATOR

0

5300 2.875G

5300 2.875G

Aavid

THERM PAD 100MX76.2MM GRAY/GREEN

0

53-03-14

53-03-14

Aavid

THERM PAD 39.7X26.67MM GRY/GRN

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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