Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
71-10777

71-10777

Henkel / Bergquist

GAP PAD 5000S35 .75"X.75"

0

GENERAL ATOMICS UHK17128 REVX2

GENERAL ATOMICS UHK17128 REVX2

Henkel / Bergquist

GP VO SOFT 0.080 CUSTOM

8

SPA2000-0.020-AC-104

SPA2000-0.020-AC-104

Henkel / Bergquist

THERM PAD 25.4MMX19.05MM W/ADH

0

Q3-0.005-00-36

Q3-0.005-00-36

Henkel / Bergquist

THERM PAD 38.1MMX19.05MM BLACK

0

B660B-0.0055-00-1112-NA

B660B-0.0055-00-1112-NA

Henkel / Bergquist

THERM PAD 304.8MMX279.4MM W/ADH

0

GP3500ULM--0.060-12-0816

GP3500ULM--0.060-12-0816

Henkel / Bergquist

GAP PAD 3500 ULM

0

GPVOU-0.080-01-0816

GPVOU-0.080-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

BG411328.01

BG411328.01

Henkel / Bergquist

EAGLE TEST SYST HAR2605G REV3

0

GPVOU-0.100-01-0816

GPVOU-0.100-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

GPVOU-0.040-01-0816

GPVOU-0.040-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

SPK4-0.006-00-1212

SPK4-0.006-00-1212

Henkel / Bergquist

THERM PAD 304.8MMX304.8MM GRAY

0

GPVOU-0.125-01-0816

GPVOU-0.125-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

GPVOU-0.020-01-0816

GPVOU-0.020-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

CPU .63X.63

CPU .63X.63

Henkel / Bergquist

THERM PAD 16MMX16MM TAN

0

BP100-0.005-00-1010

BP100-0.005-00-1010

Henkel / Bergquist

THERM PAD 254MMX254MM W/ADH WHT

0

GPVOU-0.060-01-0816

GPVOU-0.060-01-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM BK/GRY

0

CPU 1.375X1.375

CPU 1.375X1.375

Henkel / Bergquist

THERM PAD 34.93MMX34.93MM TAN

0

BOND PLY 660P 11X12

BOND PLY 660P 11X12"

Henkel / Bergquist

THERM PAD 304.8MMX279.4MM W/ADH

0

CPU .005

CPU .005" 12" X 12"

Henkel / Bergquist

THERM PAD 304.8MMX304.8MM TAN

0

SP1500ST-0.008-00-1012

SP1500ST-0.008-00-1012

Henkel / Bergquist

THERM PAD 304.80MMX254MM BLUE

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

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