Thermal - Pads, Sheets

Image Part Number Description / PDF Quantity Rfq
2591008

2591008

Henkel / Bergquist

TGP10000ULM-0.040-02-0808

0

Q3-0.005-00-105

Q3-0.005-00-105

Henkel / Bergquist

THERM PAD 36.83MMX21.29MM BLACK

0

SPK10-0.006-00-11

SPK10-0.006-00-11

Henkel / Bergquist

THERM PAD 33.32MMX19.35MM BEIGE

0

SP400-0.009-00-56

SP400-0.009-00-56

Henkel / Bergquist

THERM PAD 21.72MMX14.27MM GRAY

0

Q3-0.005-AC-108

Q3-0.005-AC-108

Henkel / Bergquist

THERM PAD 116.84MMX60.96MM W/ADH

0

2678610

2678610

Henkel / Bergquist

TGP12000ULM-0.125-00-0808

0

SP2000-0.010-AC-124

SP2000-0.010-AC-124

Henkel / Bergquist

THERM PAD 22.15MMX20.07MM W/ADH

0

Q3-0.005-AC-1212-NA

Q3-0.005-AC-1212-NA

Henkel / Bergquist

THERM PAD 304.8MMX304.8MM W/ADH

0

SP400-0.007-00-50

SP400-0.007-00-50

Henkel / Bergquist

THERM PAD 11.1MMX7.92MM GRAY

0

GP3004SF-0.125-01-0918

GP3004SF-0.125-01-0918

Henkel / Bergquist

BERGQUIST GAP PAD TGP 3004SF

1

7403-09FR-19

7403-09FR-19

Henkel / Bergquist

THERMAL PAD TO-3.009" SP400

0

SP2000-0.015-00-62

SP2000-0.015-00-62

Henkel / Bergquist

THERM PAD 19.05MMX15.24MM WHITE

0

2678611

2678611

Henkel / Bergquist

TGP12000ULM-0.060-00-0808

0

GPVO-0.040-AC-0816

GPVO-0.040-AC-0816

Henkel / Bergquist

THERM PAD 406.4MMX203.2MM W/ADH

0

SP1500ST-0.008-02-1012

SP1500ST-0.008-02-1012

Henkel / Bergquist

THERM PAD 304.80MMX254MM BLUE

0

SP400-0.007-AC-136

SP400-0.007-AC-136

Henkel / Bergquist

THERM PAD 31.75MMX25.4MM W/ADH

0

GP3500ULM 80 MIL 8

GP3500ULM 80 MIL 8"x16"

Henkel / Bergquist

GAP PAD 3500 ULM

0

Q3-0.005-00-34

Q3-0.005-00-34

Henkel / Bergquist

THERM PAD 25.4MMX19.05MM BLACK

0

2591010

2591010

Henkel / Bergquist

TGP10000ULM-0.080-02-0808

0

Q3-0.005-00-25

Q3-0.005-00-25

Henkel / Bergquist

THERM PAD 25.4MMX6.6MM BLACK

0

Thermal - Pads, Sheets

1. Overview

Thermal pads and sheets are thermally conductive materials used to transfer heat away from electronic components to heat sinks or ambient environments. They fill air gaps between uneven surfaces, improving thermal efficiency. These materials are critical in modern electronics, automotive systems, and industrial equipment to prevent overheating, enhance reliability, and ensure compliance with safety standards.

2. Main Types and Functional Classification

TypeFunctional FeaturesApplication Examples
Silicone-Based PadsHigh flexibility, low compression force, dielectric insulationSmartphones, laptops, LED lighting
Non-Silicone PadsLower cost, reduced silicone oil migrationPower supplies, industrial controls
Phase Change Materials (PCM)Softening at operational temperatures for better contactCPUs, GPUs, servers
Metal-Backed PadsAluminum/copper reinforcement for structural supportEV battery packs, high-power lasers
Graphite SheetsUltra-thin, anisotropic heat spreading5G base stations, wearable devices

3. Structure and Composition

Typical thermal pads consist of:

  • Base Material: Silicone rubber (standard), polyurethane (low-cost), or epoxy (rigid)
  • Filler: Aluminum oxide, boron nitride, or silver-coated particles for thermal conductivity
  • Adhesive Layers: Pressure-sensitive acrylic or silicone adhesives (optional)
  • Reinforcement: Fiberglass mesh or metal foils for mechanical stability

4. Key Technical Parameters

ParameterImportance
Thermal Conductivity (W/m K)Measures heat transfer efficiency (ASTM D5470)
Thickness (mm)Impacts contact resistance and compression force
Operating Temperature Range ( C)Determines material stability under thermal stress
Hardness (Shore 00)Affects conformability to surfaces
Adhesion Strength (N/mm )Critical for mechanical fixation
Electrical Insulation (kV/mm)Essential for high-voltage applications

5. Application Fields

Major industries include:

  • Consumer Electronics: Mobile phones (e.g., Samsung Galaxy series), tablets, gaming consoles
  • Automotive: EV battery thermal management (Tesla Model 3), powertrain inverters
  • Telecom: 5G base stations (Huawei AAU modules), optical transceivers
  • Industrial: CNC machines, medical imaging equipment
  • Aerospace: Avionics cooling systems

6. Leading Manufacturers & Products

ManufacturerRepresentative ProductKey Specification
Laird Performance MaterialsTHERM-A-GAP GEL 1515 W/m K, 0.5mm thickness
Bergquist (Henkel)Gap Pad 1500SSilicone-free, 8.0 W/m K
3M5595 PCMPhase change at 55 C, 12 W/m K
FujipolySARCON Matrix MGMetal-gel hybrid, 20 W/m K
MomentiveTSE 3045Graphite sheet, 400 W/m K (in-plane)

7. Selection Guidelines

Key considerations:

  • Thermal Requirements: Calculate required thermal conductivity based on power dissipation (using Fourier's Law)
  • Mechanical Constraints: Evaluate hardness-thickness trade-offs for housing clearance
  • Environmental Factors: Check temperature/chemical resistance for outdoor/automotive use
  • Cost Optimization: Balance performance vs. budget (e.g., graphite sheets cost 30% more than silicone pads)
  • Regulatory Compliance: Ensure RoHS/REACH certification for EU markets

8. Industry Trends

Emerging trends include:

  • Ultra-Thin Materials: 0.1mm graphite sheets for foldable devices
  • High-Conductivity Composites: Boron nitride nanotube-enhanced pads (30+ W/m K)
  • Smart Thermal Interfaces: Electro-responsive materials with tunable conductivity
  • Green Manufacturing: Water-based silicone formulations reducing VOC emissions
  • Integrated Solutions: Combination pads with embedded temperature sensors

RFQ BOM Call Skype Email
Top