| Image | Part Number | Description / PDF | Quantity | Rfq |
|---|---|---|---|---|
 |
t-Global Technology |
PHASE CHANGE STICK PINK 27G |
0 |
|
 |
t-Global Technology |
ONE-PART THERMAL PUTTY 500G POT |
0 |
|
 |
t-Global Technology |
NON-SILICONE PUTTY 6 W/MK 1OZ |
0 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 1LB D |
11 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 30G JAR |
103 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 4OZ L |
20 |
|
 |
t-Global Technology |
ONE-PART THERMAL PUTTY 50G POT |
46 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 30CC |
18 |
|
 |
t-Global Technology |
NON-SILICONE PUTTY 4OZ GREY |
14 |
|
 |
t-Global Technology |
THERMAL GREASE 30G GREY |
23 |
|
 |
t-Global Technology |
SILICONE PUTTY IN 30CC SYRINGE |
45 |
|
 |
t-Global Technology |
LIQUID TIM 50CC SYRINGE |
95 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 50G JAR |
7 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 1KG |
0 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL GREASE |
3 |
|
 |
t-Global Technology |
SILICONE THERMAL GREASE 1KG |
0 |
|
 |
t-Global Technology |
ONE-PART THERMAL PUTTY 30G POT |
54 |
|
 |
t-Global Technology |
NON-SILICONE PUTTY 30CC GREY |
15 |
|
 |
t-Global Technology |
THERMAL NON-SILICONE PUTTY 1LB |
5 |
|
 |
t-Global Technology |
NON-SILICONE THERMAL PUTTY 1LB L |
19 |
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Thermal interface materials (TIMs) are specialized substances designed to enhance heat transfer between mating surfaces. These materials fill microscopic air gaps and reduce thermal resistance in electronic, mechanical, and industrial systems. With increasing power densities in modern devices, effective thermal management has become critical for reliability, performance, and longevity.
| Type | Functional Characteristics | Application Examples |
|---|---|---|
| Thermal Adhesives | Permanently bond surfaces while conducting heat. Available in conductive/dielectric variants. | CPU heatsink bonding, LED module assembly |
| Epoxy Systems | Two-part compounds with high structural strength and thermal conductivity. | Power module encapsulation, motor controller assembly |
| Thermal Greases | Non-curing compounds with optimal gap-filling properties. | GPU cooling, automotive sensor mounting |
| Phase Change Materials | Temperature-activated compounds that optimize interface at operational temperatures. | Server processors, high-frequency amplifiers |
Typical formulations include:
Material microstructure is engineered to balance thermal performance with mechanical compliance.
| Parameter | Significance | Typical Range |
|---|---|---|
| Thermal Conductivity | Primary measure of heat transfer efficiency | 1-8 W/m K |
| Operating Temperature | Determines application environment suitability | -50 C to 200 C |
| Viscosity | Affects application method and gap coverage | 500-500,000 cP |
| Dielectric Strength | Electrical insulation capability | 5-30 kV/mm |
| Curing Time/Temperature | Production process compatibility | Room temp-150 C |
| Manufacturer | Key Products | Specialty |
|---|---|---|
| 3M | TC-2810 Adhesive | High-conductivity die attach |
| Dow | SYLGARD 8660 | Low-outgassing space applications |
| Henkel | Berger TIM 880 | Phase-change processor pads |
| Master Bond | EP42HT-2AO | Two-part conductive epoxy |
Key considerations:
Case Study: A server manufacturer reduced CPU operating temperatures by 12 C by switching from standard grease to a phase-change material with optimized melt profile.
Emerging developments include: